Liquid Cooling Package Architecture for Dense Chip Thermal Management
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Solution Overview
Problem
Current microelectronics packaging technologies face challenges in efficiently managing thermal energy generated by increased circuitry density, particularly in modular structures combining backside power delivery networks and signal networks.
Innovation Solution
The integration of a liquid heat exchanger with a silicon-based structure, including multiple cooling layers and fin structures, is proposed to effectively manage thermal energy by circulating cooling liquid through the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If circuitry density is increased to provide increased computation, then computational capability is improved, but thermal energy generation increases making thermal management difficult
Solution Approach 1:
The cooling system is divided into multiple separate cooling layers (first cooling layer, second cooling layer, third cooling layer) that can be independently designed and optimized. Each cooling layer can be tailored to address thermal hotspots in specific regions of the high-density circuitry, allowing effective thermal management without compromising computational capability.
Solution Approach 2:
The patent transitions from traditional single-plane cooling to a multi-layer three-dimensional cooling architecture. By stacking multiple cooling layers at different heights and orientations, the system can address thermal management in the vertical dimension while maintaining high computational density in the horizontal plane.
2Temperature
If multiple cooling layers are added to improve thermal management, then heat exchange capability is improved, but device complexity increases
Solution Approach 1:
Multiple cooling layers are merged into a single integrated liquid cooling package that functions as one cohesive thermal management system. The cooling liquid flows through all layers in a coordinated manner, allowing the system to achieve complex multi-layer cooling functionality while maintaining relatively simple system-level control and operation.
Solution Approach 2:
The liquid cooling package serves multiple functions simultaneously: it cools different regions of the circuitry, manages thermal hotspots, and provides a unified thermal management solution for the entire device. This multi-functionality reduces the need for separate cooling systems for different components, thereby reducing overall complexity.
3Loss of energy
If cooling liquid flow paths are optimized to reduce pressure drop, then fluid flow efficiency is improved, but heat exchange effectiveness may be reduced
Solution Approach 1:
The cooling system employs different fin configurations and flow path designs in different regions of the cooling layers. Regions with higher thermal loads have optimized flow paths and fin densities to maximize heat exchange, while regions with lower thermal loads have simpler configurations that minimize pressure drop. This local optimization allows the system to maintain heat exchange effectiveness while reducing overall pressure drop.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient thermal management by reducing pressure drop and enhancing heat exchange, thereby maintaining optimal operating conditions for microelectronics packaging.
Implementation Method 1
The integration of a liquid heat exchanger with a silicon-based structure, including multiple cooling layers and fin structures, is proposed to effectively manage thermal energy by circulating cooling liquid through the system
Implementation Method 2
The liquid heat exchanger may contact the signal layer
Implementation Method 3
circulating cooling liquid through the system
Data Source
AI summary
Disclosed herein are methods, systems and devices including a first layer with at least one transistor, a second layer on a first side of the first layer, the second layer including a signal layer, a third layer on a second side of the first layer, the second side opposite the first side. The third layer may include a backside power delivery device. A liquid heat exchanger may be connected to the signal layer, and the first layer, the second layer, the third layer and the liquid heat exchanger may be stacked. The liquid heat exchanger may include a first cooling layer, a second cooling layer connected to the first cooling layer, and a third cooling layer connected to the second cooling layer, the second cooling layer between the first cooling layer and the third cooling layer. The liquid heat exchanger may include an inlet contacting the second cooling layer and an outlet contacting the first cooling layer.