Liquid-Cooling Device With Partition Plate Flow Passages

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Solution Overview

Problem

Traditional liquid-cooling devices for semiconductor light sources suffer from poor heat conduction due to the inefficient design of heat-dissipating fins, leading to ineffective heat dissipation and increased temperatures, which affects the operation of semiconductor components.

Innovation Solution

A liquid-cooling device with a shell structure featuring a specific angle between the water inlet and outlet pipes, multiple heat-dissipating fins, and a partition plate creating flow passages to enhance the distribution and flow of cooling liquid, resulting in improved heat conduction performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If cooling water flows through heat-dissipating fins formed by punching a metal sheet, then the structure is simple and easy to manufacture, but the heat conduction effect is poor and cooling performance is reduced

Engineering Contradiction:
Improveheat-dissipating fin structureVSAvoidcooling water temperature
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The accommodating space is divided into multiple flow passages by partition plates, segmenting the cooling water flow path. This ensures that cooling water flows through all heat-dissipating fins sequentially, maximizing heat conduction across the entire fin array rather than allowing water to bypass certain areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Partition plates are introduced as intermediary components to guide and distribute cooling water uniformly across multiple flow passages. These plates ensure that cooling water makes full contact with all heat-dissipating fins, improving the intermediary heat transfer process between the fins and cooling water.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If the cooling water flow path is long to cover all heat-dissipating fins, then heat dissipation coverage is improved, but the cooling water temperature increases along the flow distance and heat conduction performance is reduced

Engineering Contradiction:
Improveheat dissipation coverageVSAvoidcooling water heat absorption efficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The cooling water flow path is segmented into multiple parallel passages by partition plates. Each passage contains a subset of heat-dissipating fins, allowing cooling water to flow through all fins while maintaining shorter individual flow paths. This segmentation prevents excessive temperature rise in the cooling water while ensuring complete heat dissipation coverage.

Inventive Principle:
Principle #1Segmentation

3Device complexity

If the water inlet and outlet pipes are arranged in a traditional manner, then the structure is simple, but the impact cooling effect is insufficient and heat dissipation performance is reduced

Engineering Contradiction:
Improvepipe arrangement structureVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The water outlet pipe is positioned at the front plate while the water inlet pipe is at the top plate, creating a three-dimensional angular arrangement (70-110 degrees) rather than a simple linear or parallel configuration. This spatial arrangement enables the cooling water to generate an impact cooling effect on the bottom plate, adding a dimensional aspect to the heat dissipation process that enhances thermal management.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heat dissipation by creating an impact cooling effect and better distribution of cooling liquid, reducing heat resistance by 14% and voltage drop by 7% compared to existing devices.

Implementation Method 1

cooling water enters the heat-dissipating module to absorb the waste heat and to dissipate the waste heat to external air in manners such as conduction and convection

Methodology Applied
Scientific EffectConduction: Conduction (thermal)

Implementation Method 2

cooling water enters the heat-dissipating module to absorb the waste heat and to dissipate the waste heat to external air in manners such as conduction and convection

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

when cooling liquid enters the shell from at least one water inlet pipe, an impact cooling effect can be produced on a part of the bottom plate of the shell

Methodology Applied
Scientific EffectImpact cooling: Impact Force

Data Source

PatentUS10827647B2Liquid-cooling device
Publication Date: 2020.11.03 CORETRONIC CORPORATION
  • US10827647B2 patent drawing
  • US10827647B2 patent drawing
  • US10827647B2 patent drawing

AI summary

The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.