Liquid Cooling for Peripheral PCB Electronics
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Solution Overview
Problem
Current cooling technologies for peripheral printed circuit boards (PCBs) are inadequate in providing efficient and adaptable thermal management for high-power electronic components, as they often rely on air cooling and lack the flexibility to accommodate diverse system designs and increasing power density, leading to inefficiencies in heat dissipation and compatibility with different thermal systems.
Innovation Solution
A liquid cooling apparatus featuring a cooling frame with rotatable frames, a cushion arrangement for pressure and insulation, and a hose management system that includes anchors for hose extension and connection, allowing for easy assembly, reconfiguration, and compatibility with various system designs, while providing physical protection and enhanced rigidity to the peripheral board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid cooling is implemented for high-power components on peripheral PCB, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling apparatus is divided into separate functional modules: a cooling frame for structural support, a cushion frame for positioning and contact pressure, and a locking arrangement for securing. This segmentation allows each component to be optimized independently while simplifying the overall assembly and maintenance processes, thereby managing complexity while achieving effective liquid cooling for high-power components.
Solution Approach 2:
The cooling frame serves multiple functions simultaneously: it provides structural support for the peripheral PCB, houses the liquid cooling system, and works with the locking arrangement to secure the board in place. This multi-functionality reduces the number of separate components needed, thereby reducing overall device complexity while maintaining effective heat dissipation.
2Manufacturing precision
If a fixed cooling structure is used for peripheral PCB, then manufacturing precision is improved, but adaptability to different system designs deteriorates
Solution Approach 1:
The cushion frame is designed to be rotatable relative to the cooling frame, allowing the cooling apparatus to adapt to different orientations and configurations of peripheral PCBs. This dynamic element enables the same cooling structure to accommodate various system designs while maintaining precise thermal contact through the cushioning mechanism, thereby achieving both manufacturing precision and adaptability.
Solution Approach 2:
The locking arrangement allows for adjustable positioning of the cooling frame relative to the peripheral PCB, enabling optimization of contact pressure and thermal conductivity for different systems. By allowing parameter changes in position and contact force, the system maintains manufacturing precision while adapting to different hardware configurations.
3Ease of manufacture
If modular cooling components are used, then ease of assembly is improved, but structural stability deteriorates
Solution Approach 1:
The cooling frame and cushion frame are merged into a single integrated assembly that works together through the locking arrangement to secure the peripheral PCB. This merging provides structural stability while maintaining ease of assembly, as the combined structure can be installed as a unit while still allowing for modular replacement of individual components like the cushion frame or cooling plates.
Solution Approach 2:
The locking arrangement is pre-configured to work with the cooling frame and cushion frame, providing stable securing of the peripheral PCB before the liquid cooling system is fully assembled. This preliminary stabilization ensures structural integrity while allowing for easy assembly of subsequent cooling components, as the base structure is already in place and secured.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal conditions by ensuring proper contact and heat removal for high-power components, enhancing the reliability and interoperability of peripheral devices across different systems without compromising performance, and provides a modular design for easy installation and adaptation to various hardware environments.
Implementation Method 1
at least one cooling device mounted onto the cooling frame... ensuring proper contact and heat removal for high-power components
Implementation Method 2
a cushion arrangement attached to the cushion frame... providing physical protection and enhanced rigidity
Data Source
Figure 1
Figure 2A~2C
Figure 2D~4
AI summary
A liquid cooling arrangement for peripheral board incorporates cooling plates (115) on one side and resilient cushion (120) on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion (120) exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses (125) are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.