Liquid Cooling Plate Layout for Tight Electronic Spaces
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Solution Overview
Problem
Current water-cooling heat dissipation devices in electronic devices face inefficiencies due to the space requirements of copper tubes, which complicate the installation of additional components and hinder optimal space utilization.
Innovation Solution
A cooling device with a heat dissipation plate assembly that forms a heat dissipation channel using a recessed structure, incorporating a first and second plate with a pump, liquid inlet, and outlet, and fins to enhance space utilization and maintain cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper tubes are used to form heat dissipation channels, then cooling efficiency is maintained, but space utilization deteriorates due to bending requirements
Solution Approach 1:
The heat dissipation channel is segmented into multiple straight sections (first heat absorption section, first heat dissipation section, second heat dissipation section, third heat dissipation section, fourth heat dissipation section, second heat absorption section) connected by connecting sections, eliminating the need for bending while maintaining the cooling function
Solution Approach 2:
The heat dissipation channel transitions from a two-dimensional bent tube layout to a three-dimensional plate structure, allowing the channel to extend in multiple directions within the plate plane without requiring vertical bending space
2Temperature
If intricate tube layout is used for heat dissipation, then cooling coverage is improved, but device complexity increases due to bent portions
Solution Approach 1:
The channel is divided into multiple functional sections (heat absorption sections thermally coupled to heat sources, heat dissipation sections for cooling) that can be independently designed and assembled, simplifying the overall installation process while achieving comprehensive heat dissipation coverage
Solution Approach 2:
The heat dissipation channel is pre-formed as a flat plate structure with all sections and connecting sections integrated, eliminating the need for complex on-site bending and assembly operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design optimizes internal space within electronic devices by minimizing the space taken by bent portions of the flow channel, allowing for intricate heat dissipation pathways without compromising cooling efficiency.
Implementation Method 1
the first plate having a recessed structure and being configured for thermal coupling to at least one heat source
Implementation Method 2
the heat dissipation channel being configured to contain the cooling liquid, and the liquid inlet and liquid outlet being in fluid communication with the heat dissipation channel
Data Source
AI summary
A cooling device containing a cooling liquid includes a heat dissipation plate assembly and a pump. The heat dissipation plate assembly comprises a first plate and a second plate. The first plate features a recessed structure for thermally coupling with a heat source. The second plate covers the recessed structure to form a heat dissipation channel including an inlet and an outlet, among others. The heat dissipation channel accommodates the cooling liquid. The pump is in communication with both the inlet and outlet and serves to circulate the cooling liquid through the channel.