Liquid Cooling Pluggable Module Thermal Management
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing thermal loads in pluggable modules of communication systems, leading to reliability and performance issues due to heat generation during operation.
Innovation Solution
The implementation of a liquid cooling system within the receptacle assembly and pluggable module, where a liquid cooling channel is coupled to the receptacle housing and the pluggable module, allowing for fluid communication and direct cooling of the module circuit board and electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used to dissipate heat from the pluggable module, then some thermal management is provided, but the heat sinks are inadequate for the thermal loads generated by high-speed pluggable modules
Solution Approach 1:
The patent implements a liquid cooling system where a coolant flows through cooling channels formed in the pluggable module housing and receptacle assembly. The liquid coolant absorbs heat from the module components through thermal conduction and convects it away, providing superior heat dissipation compared to conventional air-cooled heat sinks. This hydraulic cooling approach directly addresses the inadequate thermal management of traditional heat sinks for high-speed modules.
2Temperature
If a liquid cooling system is implemented, then effective heat dissipation is achieved, but the device complexity increases due to additional cooling channels and fittings
Solution Approach 1:
The patent integrates the liquid cooling functionality into the existing structural components of the pluggable module and receptacle assembly. The cooling channels are formed within the housing structures themselves, and the cooling fittings are incorporated into the existing electrical connector interfaces. This merging of cooling functions with structural components provides effective heat dissipation while minimizing additional complexity.
Solution Approach 2:
The housing structures of the pluggable module and receptacle assembly serve dual functions: providing mechanical support and structural integrity while simultaneously acting as heat sinks and conduits for liquid cooling. The fittings serve both electrical connection purposes and liquid flow control. This multi-functionality reduces overall system complexity by eliminating separate dedicated cooling components.
3Temperature
If cooling channels are integrated into the pluggable module housing, then direct cooling of electronic components is achieved, but the manufacturing complexity increases
Solution Approach 1:
The patent utilizes additive manufacturing (3D printing) technology to create the pluggable module housing with integrated cooling channels. This manufacturing approach allows for complex internal geometries and channel configurations that would be difficult or impossible to achieve with traditional subtractive manufacturing methods. The additive process directly deposits material layer by layer, forming the cooling channels as part of the housing structure, thereby enabling efficient component cooling while managing manufacturing complexity through advanced fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from the pluggable modules, enhancing the reliability and electrical performance of communication systems by providing a cost-effective thermal management solution.
Implementation Method 1
a liquid cooling channel coupled to the receptacle housing and the pluggable module, allowing for fluid communication and direct cooling of the module circuit board and electronic components
Implementation Method 2
liquid cooling channel providing liquid cooling supply for the pluggable module
Data Source
AI summary
A communication system includes a receptacle assembly and a pluggable module. The receptacle assembly has a receptacle housing includes walls forming a module cavity with a communication connector at a back end thereof. The receptacle assembly has a liquid cooling assembly having a liquid cooling channel coupled to the receptacle housing and a fitting in flow communication with the liquid cooling channel. The pluggable module is receivable in the module cavity and has a pluggable body holding a module circuit board and a liquid cooling assembly coupled to the pluggable body. The liquid cooling assembly includes a liquid cooling channel in thermal communication with the pluggable body and a module fitting mated with the fitting of the receptacle assembly to couple the liquid cooling channel of the pluggable module in flow communication with the liquid cooling channel of the receptacle assembly.