Liquid Cooling Structure for Semiconductor Heat Dissipation
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Solution Overview
Problem
Semiconductor modules, such as memory modules, face challenges with low heat dissipation efficiency due to the mounting of semiconductor devices on printed circuit boards, necessitating the development of a more effective cooling system to manage the high heat generated by these devices.
Innovation Solution
A liquid cooling system comprising a lower structure and an upper structure that form a channel for a cooling fluid to flow, with a heat dissipation pad and heat dissipation pipe configuration, including quadrangular passages and a connection passage to control temperature, enhancing heat dissipation efficiency by optimizing the flow and contact area with the semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor devices are mounted on PCB to achieve high integration, then device functionality is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent employs liquid cooling technology by introducing a cooling fluid circulation system with channels formed in the upper structure. The cooling fluid flows through these channels to directly remove heat from the semiconductor devices, replacing conventional air cooling methods and significantly improving heat dissipation efficiency while maintaining high integration functionality.
2Temperature
If cooling structures are added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent integrates the cooling channels directly into the upper structure of the semiconductor module housing, merging the cooling function with the structural component. This integration approach eliminates the need for separate cooling components, reducing overall system complexity while achieving effective temperature control through the cooling fluid circulation system.
3Temperature
If multiple passages are used to enhance cooling, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The cooling system is divided into multiple independent passages within the upper structure, allowing the cooling fluid to flow through different paths and efficiently cool multiple semiconductor devices simultaneously. This segmentation enables enhanced heat dissipation while the passages are integrated into the upper structure during a single manufacturing process, minimizing additional manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling system effectively dissipates heat from semiconductor devices by optimizing the flow and temperature control within the cooling channel, improving cooling efficiency and facilitating easy assembly and maintenance.
Implementation Method 1
The heat dissipation pipe may be configured to make contact with the heat dissipation pad
Implementation Method 2
A channel through which a cooling fluid may flow may be formed in the heat dissipation pipe
Data Source
AI summary
A liquid cooling structure may include a lower structure and an upper structure. The lower structure may be configured to cover one surface of an object. The upper structure may be combined with the lower structure to provide a channel through which a cooling fluid may flow. The channel may include a plurality of passages connected between a channel inlet through which the cooling fluid may enter and a channel outlet through which the cooling fluid may exits.