Direct Liquid Cooling Substrate for High-Heat-Flux Semiconductors
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Solution Overview
Problem
Existing cooling technologies for semiconductor devices, such as metal heat sinks, are inadequate for high heat flux scenarios, leading to overheating and potential circuit failures due to insufficient thermal conductivity and the need for isolation components that reduce efficiency.
Innovation Solution
A direct liquid cooling system where semiconductor devices are mounted directly on a die substrate with integrated cold plates containing cooling liquid channels, allowing for direct heat dissipation using circulating liquid, with optional galvanic isolation between channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional metal heat sinks are used for cooling semiconductor devices, then the structure is simple and easy to manufacture, but the thermal conductivity is insufficient for high heat flux scenarios leading to overheating
Solution Approach 1:
The patent employs liquid cooling channels integrated into the substrate to replace traditional metal heat sinks. Cooling liquid flows through these channels to directly absorb heat from semiconductor devices, significantly enhancing heat dissipation capability for high heat flux applications while maintaining a compact structure.
Solution Approach 2:
The cooling channels are integrated directly into the substrate structure, merging the substrate and cooling system into a single unified component. This eliminates the need for separate metal heat sinks and isolation components, reducing overall device complexity while improving thermal management efficiency.
2Reliability
If isolation components are used to separate semiconductor devices and cooling components, then electrical isolation is achieved, but the effectiveness and efficiency of heat dissipation is reduced
Solution Approach 1:
The substrate serves as an intermediary component that simultaneously provides electrical isolation and thermal conduction. By integrating cooling channels into the substrate, the system achieves both electrical separation between devices and efficient heat transfer to the cooling liquid, eliminating the need for additional isolation components that would impede thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity, maintains device temperature within safe ranges, preventing overheating and circuit failures, and improves operational reliability.
Implementation Method 1
the cold plate may be positioned proximate to the semiconductor device and may be configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device
Implementation Method 2
The cooling liquid may be configured to circulate within the enclosed channel
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.