Liquid-Cooling Heat Dissipation Unit for Stronger Server Mounting
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Solution Overview
Problem
Existing liquid-cooling heat dissipation devices for GPU chips are prone to damage due to low structural strength during installation and disassembly, and they occupy excessive space within the server chassis.
Innovation Solution
A liquid-cooling heat dissipation unit comprising a liquid-cooling plate body and a support plate, with enhanced structural integrity through positioning parts, brackets, and optimized pipeline arrangements, reducing the overall height and improving durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid-cooling plates are assembled with aluminum alloy cover plates and base plates connected by rubber hoses, then the device achieves liquid-cooling heat dissipation function, but the overall structural strength becomes low and the device is prone to damage during disassembly and installation
Solution Approach 1:
The patent applies composite materials by combining copper (high strength, high thermal conductivity) for the cooling plate body with aluminum alloy (lightweight, good thermal conductivity) for the support plate. This composite structure achieves both high structural strength and effective heat dissipation, resolving the contradiction between reliability and ease of operation during installation
Solution Approach 2:
The patent merges the cooling plate body and support plate into an integrated liquid-cooling heat dissipation unit with unified fastening mechanisms. This integration strengthens the overall structure while maintaining ease of installation through standardized connecting holes and fasteners, addressing both structural strength and operational ease
2Reliability
If multiple liquid-cooling plates are arranged with inlet and outlet water systems connected via rubber hoses, then heat dissipation function is achieved, but the device occupies excessive space within the server chassis
Solution Approach 1:
The patent applies nesting by integrating the water inlet and outlet channels directly within the liquid-cooling plate body structure. The cooling channels are nested inside the plate, eliminating the need for external rubber hoses and connecting components, thereby reducing the overall volume and space occupation in the server chassis while maintaining effective heat dissipation
Solution Approach 2:
The patent transitions from a three-dimensional external hose connection system to a two-dimensional integrated channel system within the plate structure. This dimensional change consolidates the water flow path into the plane of the cooling plate, significantly reducing the vertical and lateral space requirements in the server chassis
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the structural strength and reduces the risk of damage during installation and disassembly, while minimizing space occupation, making it suitable for compact server designs.
Implementation Method 1
liquids have a much higher specific heat capacity than air, making liquid-cooling heat dissipation device more efficient than air-cooling heat dissipation
Implementation Method 2
a liquid-cooling plate body and a support plate; the liquid-cooling plate body provided with a liquid-cooling cavity, a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are both communicated with the liquid-cooling cavity
Data Source
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AI summary
The present disclosure relates to the technical field of liquid-cooling heat dissipation devices, and discloses a liquid-cooling heat dissipation unit, a liquid-cooling heat dissipation device and a server wherein the liquid-cooling heat dissipation unit includes a liquid-cooling plate body and a supporting plate; The liquid cooling plate body is provided with a liquid-cooling cavity, a liquid inlet and a liquid outlet, both of which are communicated with the liquid-cooling cavity; The support plate is adapted to connect to the component to be cooled, and the liquid-cooling plate body is connected to connected to one side of the support plate facing the component to be cooled. The liquid-cooling heat dissipation unit disclosed by the present disclosure has high overall strength and is not easy to be damaged.