Passive Liquid Cooling Cold Plate Using Siphon Circulation
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Solution Overview
Problem
Conventional heat sinks for electronic/computer products with aluminum extrusions and fans are inefficient, costly, and prone to fan failures, compromising cooling performance and practicality.
Innovation Solution
A liquid cooling heat dissipation device utilizing a coolant cold plate with flow channels, heating elements, and a condenser, employing the siphon principle and pressure differential to circulate coolant vaporization and condensation without energy-consuming fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If powerful fans are mounted on the fins of the aluminum extrusion to rapidly dissipate heat, then cooling efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the fan component from the heat dissipation system, replacing active cooling with a passive liquid circulation system. The coolant circulation loop removes the need for mechanical fans while maintaining effective heat transfer from the CPU/GPU to the heat dissipation fins.
Solution Approach 2:
The system employs natural convection and phase change of the coolant to drive circulation without external mechanical power. The coolant automatically circulates through evaporation at the heat source and condensation at the heat dissipation fins, creating a self-sustaining cooling cycle that eliminates the need for powered fans.
2Temperature
If powerful fans are mounted on the fins of the aluminum extrusion to rapidly dissipate heat, then cooling efficiency is improved, but energy consumption increases
Solution Approach 1:
The coolant circulation is driven by natural convection currents and phase change mechanisms rather than powered fans. The system uses the temperature difference between the heated coolant at the CPU/GPU and the cooler ambient air at the fins to create continuous circulation, eliminating energy consumption associated with mechanical cooling components.
Solution Approach 2:
The patent utilizes phase transition of the coolant (evaporation and condensation) to transfer heat and drive circulation. The coolant evaporates at the heat source absorbing latent heat, then condenses at the heat dissipation fins releasing latent heat, creating a thermodynamic cycle that cools the system without requiring external energy input for fans.
3Temperature
If powerful fans are mounted on the fins of the aluminum extrusion to rapidly dissipate heat, then cooling efficiency is improved, but reliability decreases due to fan failures
Solution Approach 1:
The patent removes the fan component entirely from the system, eliminating the source of fan-related failures. The passive liquid circulation system has no moving mechanical parts that can fail, significantly improving system reliability while maintaining cooling performance.
Solution Approach 2:
The cooling system operates without powered components that require maintenance or can fail. The natural convection-driven coolant circulation provides passive, maintenance-free operation, eliminating reliability issues associated with fan motors, bearings, and control electronics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency, reduces costs, and eliminates fan-related failures by using the siphon effect and pressure differential for coolant circulation, promoting rapid heat dissipation.
Implementation Method 1
heating elements to heat the coolant in the flow channels, causing the low-temperature liquid coolant to absorb heat and vaporize
Implementation Method 2
The vaporized coolant rises through the tubes to the condenser where it is cooled back to liquid form
Implementation Method 3
Utilizing the siphon principle and generating a pressure differential, the coolant then circulates downward through the opposing tubes
Implementation Method 4
Utilizing the siphon principle and generating a pressure differential, the coolant then circulates downward through the opposing tubes
Data Source
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AI summary
A liquid cooling dissipation device for electronic/computer products includes a top cover with a coolant cold plate and two cooling brackets. The cold plate has at least two sets of flow channels for accommodating coolant and connects to multiple heating elements. It features inlets and outlets at both ends, all connected to the flow channels. Tubes with mounting brackets at the top end are installed at these points. A condenser, mounted on the mounting brackets and featuring side brackets, includes at least two cooling flow channels, multiple heat-conducting plates, and several heat dissipation fins. The cold plate consists of four laminated layers: a first-layer bottom plate, a second-layer composite plate, a third-layer metal plate, and a fourth-layer top plate. Heat from the heating elements vaporizes the coolant, which the condenser returns to liquid, circulating via siphon effect and pressure differential.