Liquid Cooling Assembly With Sub-Flow Channels for Supercomputing Chips
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Solution Overview
Problem
Existing liquid cooling assemblies for high-performance computing devices, such as supercomputing servers, face challenges in efficient manufacturability, assembly, and reliability due to the significant heat generated by multiple high-performance chips.
Innovation Solution
A liquid cooling assembly with an integrally formed bottom shell, sidewall, flow channel dividing walls, and heat dissipation fins, which is assembled by fitting a top plate over the sidewall, enhancing heat dissipation efficiency through sub-flow channels and rib groups for precise chip contact, and utilizing positioning structures for rapid assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple high-performance chips are integrated to meet high computing power demands, then computing power increases, but cumulative heat generation increases significantly
Solution Approach 1:
The patent employs liquid cooling technology by introducing coolant flow channels within the housing structure. The coolant circulates through these channels to absorb and remove heat generated by high-performance chips, effectively managing thermal loads while maintaining high computing power operation.
Solution Approach 2:
The patent integrates heat dissipation fins extending from the housing surface, utilizing the third dimension (vertical/external space) to increase heat exchange area. This dimensional expansion allows more efficient heat rejection to the surrounding environment without occupying additional horizontal space.
2Temperature
If complex cooling structures are designed to improve heat dissipation efficiency, then heat dissipation efficiency improves, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent combines the housing structure with integrated cooling channels and heat dissipation fins into a unified component. This merging of structural and thermal management functions simplifies manufacturing processes and assembly operations while maintaining effective heat dissipation performance.
Solution Approach 2:
The housing structure serves multiple functions simultaneously: it provides mechanical support, contains the coolant flow channels for heat removal, and incorporates external heat dissipation fins. This multi-functionality reduces the need for separate cooling components, thereby simplifying manufacturing and assembly.
3Temperature
If traditional liquid cooling assemblies are used, then heat dissipation is achieved, but assembly efficiency is low and reliability is compromised
Solution Approach 1:
The patent integrates cooling channels, heat dissipation fins, and housing into a single unified structure. This integration eliminates multiple assembly steps and potential connection points for failure, thereby improving assembly efficiency and operational reliability while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution facilitates efficient manufacturing and assembly while significantly improving heat dissipation efficiency and reliability by ensuring rapid heat transfer from chip strips to the coolant, reducing turbulence, and maintaining consistent temperature across chip strips.
Implementation Method 1
the flow channel dividing wall divides the flow channel into a plurality of communicated sub-flow channels... facilitating rapid heat transfer from chip strips to the coolant
Implementation Method 2
the plurality of heat dissipation fins are distributed within each of the sub-flow channels... ensuring rapid heat transfer from chip strips to the coolant
Data Source
AI summary
Disclosed are a liquid cooling assembly, a computing and liquid cooling unit, and a supercomputing server. The liquid cooling assembly is applicable to the supercomputing server and includes a bottom shell and a top plate. The bottom shell includes a base plate, a sidewall, at least one flow channel dividing wall, and a plurality of heat dissipation fins. The sidewall is disposed on an upper surface of the base plate and is arranged in an annular shape, forming a flow channel for a coolant within the annular shape. The flow channel dividing wall is disposed within the sidewall, wherein one end of the flow channel dividing wall is connected to the sidewall, and another end of the flow channel dividing wall is not in contact with any part of the sidewall. The flow channel dividing wall divides the flow channel into a plurality of communicated sub-flow channels.