Liquid Cooling Device for Switching Chips and Optical Modules
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Solution Overview
Problem
Traditional air cooling methods are insufficient for effectively dissipating heat from next-generation high-power optical modules and switching chips, particularly in high-power density environments where temperatures exceed 70°C and 105°C, respectively, leading to overheating issues.
Innovation Solution
A liquid cooling device with a closed cooling liquid circulation system comprising a first cooling plate attached to the switching chip, a second cooling plate attached to the optical module, an air-liquid heat exchanger, and a transmission pipe, which circulates cooling liquid to absorb and dissipate heat, while a cooling fan preheats air to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling method is used, then device complexity is low, but heat dissipation capability is insufficient for high-power optical modules and switching chips
Solution Approach 1:
The patent applies liquid cooling technology by introducing a cooling liquid circulation system with cooling plates, pipelines, and pumps to replace traditional air cooling. The cooling liquid flows through channels attached to high-power components (optical modules and switching chips) to directly absorb and remove heat, achieving effective heat dissipation for high-power density devices while maintaining controlled system complexity through modular design.
2Volume of moving object
If optical modules are stacked in case for use, then space utilization is improved, but heat dissipation difficulty increases
Solution Approach 1:
The patent merges the cooling function with the structural housing by integrating cooling plates directly onto the cases containing optical modules and switching chips. This allows multiple stacked components to share a unified liquid cooling system, where cooling plates are attached to each component's housing, enabling efficient heat removal while maintaining compact stacked arrangement and improving space utilization.
3Loss of energy
If upstream air is preheated by central processing unit, then energy utilization is improved, but cooling capability for switching chip and optical modules is weakened
Solution Approach 1:
The patent segments the heat dissipation system into independent liquid cooling circuits for different high-power components (optical modules and switching chips). Each component has dedicated cooling plates with separate cooling channels, allowing independent temperature control and optimized cooling performance for each component, preventing the heat from one component from affecting the cooling efficiency of others.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling device effectively reduces the temperature of switching chips and optical modules by circulating cooling liquid and preheated air, addressing overheating issues and supporting dual air flow directions, thereby ensuring reliable operation under high power consumption conditions.
Implementation Method 1
a first cooling plate attached to the switching chip and used for performing heat dissipation to the switching chip; a second cooling plate attached to the optical module and used for performing heat dissipation to the optical module
Implementation Method 2
an air-liquid heat exchanger used for containing cooling liquid and performing cooling to backflow cooling liquid through cooling air
Implementation Method 3
a transmission pipe respectively connected with the first cooling plate, the second cooling plate and the air-liquid heat exchanger and used for sequentially transmitting the cooling liquid flowing out from the air-liquid heat exchanger to the first cooling plate and the second cooling plate, which then flows back to the air-liquid heat exchanger
Implementation Method 4
a cooling fan preheats air to enhance cooling efficiency
Data Source
AI summary
A liquid cooling device, which is used for performing heat dissipation to switching chips and optical modules in the electronic device, and comprises: a first cooling plate attached to the switching chip and used for performing heat dissipation to the switching chip; a second cooling plate attached to the optical module and used for performing heat dissipation to the optical module; an air-liquid heat exchanger used for containing cooling liquid and performing cooling to backflow cooling liquid through cooling air; a transmission pipe used for sequentially transmitting the cooling liquid flowing out from the air-liquid heat exchanger to the first cooling plate and the second cooling plate, which then flows back to the air-liquid heat exchanger; and a power device used for controlling the cooling liquid in the transmission pipe to be sequentially transmitted to the first cooling plate and the second plate and then flow back.