Liquid Cooling Test Socket for High-Power Chip Thermal Management
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Solution Overview
Problem
Existing chip-testing apparatuses face challenges in maintaining a constant temperature environment due to heat generation during testing, leading to solder ball melting, adherence to probes, and potential short circuits, which can result in equipment damage.
Innovation Solution
A temperature control system comprising a test socket with fluid inlet and outlet portions, a temperature-controlling fluid supply device, and a recovery device that circulates a non-conductive heat-conducting fluid to regulate the temperature of the chip, solder balls, and probes, preventing melting and ensuring a constant test environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power for testing chips with complex functions is increased to reach the required level (800 W to 2,600 W), then the testing capability and function complexity are improved, but the solder balls are heated to melting point causing them to melt and adhere to probes
Solution Approach 1:
A cooling medium is introduced as an intermediary substance between the chip and the external environment. The cooling medium flows through channels in the test socket, absorbing heat from the chip and solder balls during testing, thereby preventing the solder balls from reaching melting temperature while allowing high power testing to proceed
Solution Approach 2:
The patent employs a hydraulic cooling system where a liquid cooling medium circulates through the test socket. The fluid flow removes heat generated during high-power testing through convection, enabling sustained high power operation without thermal damage to solder balls
2Temperature
If the pressing head temperature controller is set to a low temperature (e.g., -40° C.) for low temperature testing, then the desired test temperature is achieved, but a considerable temperature gradient is formed in the chip thickness direction due to thermal resistance
Solution Approach 1:
The patent transitions from single-point contact cooling (pressing head) to distributed multi-dimensional cooling by incorporating cooling channels throughout the test socket structure. This allows temperature control at multiple locations simultaneously, eliminating temperature gradients in the chip thickness direction while maintaining the desired test temperature
3Productivity
If the number and distribution density of probes in the test socket are increased to accommodate more chip contacts, then the chip processing capability is improved, but the heat generated during testing is directly conducted to the solder balls and probes
Solution Approach 1:
The patent extracts the heat management function from the mechanical test socket structure and creates a separate, dedicated cooling system. By incorporating internal cooling channels and using a circulating cooling medium, the system removes heat at its source before it can be conducted to the solder balls and probes, enabling high-density probe configurations without thermal damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools the chip and its components, preventing solder ball melting and maintaining a consistent temperature, thereby reducing the risk of equipment damage and ensuring accurate test results.
Implementation Method 1
a non-conductive heat-conducting fluid to regulate the temperature of the chip, solder balls, and probes
Implementation Method 2
the temperature-controlling fluid supply device supplies a temperature-controlling fluid to the chip slot through the fluid inlet portion, and the temperature-controlling fluid recovery device draws the temperature-controlling fluid from the chip slot
Data Source
AI summary
The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.