Liquid Cooling Plate Assembly for CPU and VR Chip Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods for voltage regulator chips (VR chips) in servers are insufficient to effectively and efficiently dissipate the increased heat generated by high-performance VR chips.
Innovation Solution
A liquid cooling plate assembly is designed to be in thermal contact with both CPU and VR chips, utilizing multiple heat dissipation parts and fluid channels to facilitate efficient heat exchange and dissipation through a coolant flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat dissipation fins with passive or active air cooling are used for VR chips, then the structure is simple and easy to manufacture, but the heat dissipation effectiveness is insufficient for high-performance VR chips
Solution Approach 1:
The patent applies liquid cooling technology by introducing a liquid cooling plate with fluid channels that circulate coolant to directly absorb heat from VR chips and CPU. This hydraulic cooling system replaces the insufficient air cooling method, enabling effective heat dissipation for high-performance chips while maintaining manufacturing feasibility through standardized liquid cooling plate production
Solution Approach 2:
The patent merges the cooling of multiple heat-generating components (CPU and multiple VR chips) into a single integrated liquid cooling plate assembly. The cooling plate simultaneously contacts both CPU and VR chips, with fluid channels configured to cool all components through one unified liquid cooling system, improving overall heat dissipation efficiency
2Reliability
If liquid cooling plate assembly with multiple heat dissipation parts and fluid channels is used, then heat dissipation effectiveness is improved, but device complexity increases
Solution Approach 1:
The liquid cooling plate is designed as a multi-functional component that simultaneously serves as a heat dissipation device for both CPU and VR chips. The single cooling plate integrates multiple heat dissipation parts with configured fluid channels that can cool different components with varying heat loads, reducing the need for separate cooling systems and thereby limiting complexity increase
Solution Approach 2:
The cooling plate features locally optimized heat dissipation structures with different regions designed for specific cooling needs. The fluid channels are strategically positioned and sized to provide appropriate cooling capacity at different locations on the plate, matching the local heat generation characteristics of CPU and VR chips while maintaining overall system simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling plate assembly effectively and efficiently dissipates heat from both CPU and VR chips, achieving temperature reductions within safe operational ranges for the VR chips, thereby improving cooling performance compared to conventional methods.
Implementation Method 1
The liquid cooling plate assembly is configured to be in thermal contact with two first heat sources and a plurality of second heat sources
Implementation Method 2
The first heat dissipation part has a first fluid chamber. The second heat dissipation part has a first fluid channel... The coolant flow facilitates efficient heat exchange and dissipation
Data Source
AI summary
A liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connection tube and a second connection tube. The first liquid cooling plate includes a first heat dissipation part and a second heat dissipation part connected to each other. The first heat dissipation part has a first fluid chamber. The second heat dissipation part has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and a fourth heat dissipation part connected to each other. The third heat dissipation part has a second fluid chamber. The fourth heat dissipation part has a second fluid channel in fluid communication with the second fluid chamber. The first connection tube communicates the second fluid chamber with the first fluid chamber. The second connection tube communicates the second fluid channel with the first fluid channel.