Liquid Crystal Panel Cutting Device with Dual Opposing Cutters

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Solution Overview

Problem

Conventional cutting methods for liquid crystal panels result in material waste and increased production costs due to liquid crystal leakage and the inability to cut large panels into smaller usable components, as the cutting process often malpositions the cut edges, making one component unusable.

Innovation Solution

A cutting device with a first cutter that cuts the upper plate downward along the gravity direction and a second cutter that cuts the lower plate upward in a reverse direction, with the second cutter positioned between the first cutter's wheels, allowing for precise cutting and minimizing liquid crystal leakage, and optionally including a sensing member to ensure proper panel alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional cutting method is used to cut liquid crystal panel, then cutting process is simple, but liquid crystal leaks from the cut edge making one component unusable

Engineering Contradiction:
Improvecutting process simplicityVSAvoidcut edge integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The cutting device is divided into two independent cutters: a first cutter for cutting the upper substrate and a second cutter for cutting the lower substrate. This segmentation allows each cutter to be optimized for its specific function, with the second cutter specifically designed to prevent liquid crystal leakage by cutting the lower substrate at a precise location that seals the liquid crystal layer.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of cutting only the upper substrate and relying on gravity to control liquid crystal flow, the invention introduces a second cutter that cuts the lower substrate upward in reverse direction. This inverted cutting approach allows precise control over the cut edge position on the lower substrate, ensuring the liquid crystal layer is properly sealed and preventing leakage.

Inventive Principle:
Principle #13The other way round (Inversion)

2Ease of operation

If conventional cutting method is used to cut large liquid crystal panel into several small panels, then cutting operation is straightforward, but material waste increases due to unusable components

Engineering Contradiction:
Improvecutting operation simplicityVSAvoidliquid crystal panel material waste
Core Design Contradiction:
Ease of operationVSLoss of substance

Solution Approach 1:

The dual-cutter system enables independent control of cuts on upper and lower substrates, allowing precise positioning of cut edges. This precision ensures that both components created from large panels are usable, eliminating the need to discard panels due to malpositioned cuts or liquid crystal leakage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The control member coordinates the timing and positioning of both cutters to ensure precise alignment and sealing. The system provides feedback control to maintain accurate cut positions, ensuring that liquid crystal panels are divided into usable components without material waste.

Inventive Principle:
Principle #23Feedback

3Device complexity

If single cutter is used to cut liquid crystal panel, then device structure is simple, but precise cutting and alignment cannot be achieved

Engineering Contradiction:
Improvecutting device structureVSAvoidcutting and alignment accuracy
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The cutting device is segmented into two independent cutters with separate control mechanisms. Each cutter can be precisely positioned and controlled independently, allowing accurate alignment and cutting without requiring a single complex cutter system. The first cutter handles the upper substrate while the second cutter handles the lower substrate with precise positioning.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention adds a dimensional aspect by introducing a second cutter that operates on the lower substrate in a different spatial plane. This dual-plane approach enables precise alignment and cutting accuracy that cannot be achieved with a single cutter, as each cutter can be optimized for its specific substrate layer.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11372278B2Liquid crystal panel cutting device and method for cutting liquid crystal panel
Publication Date: 2022.06.28 LITEMAX ELECTRONICS
  • US11372278B2 patent drawing
  • US11372278B2 patent drawing
  • US11372278B2 patent drawing

AI summary

A liquid crystal panel cutting device for cutting a liquid crystal panel includes a first cutter, a second cutter and a control member, the first cutter having two first cutting wheels that are separated from each other with a distance; the second cutter having a second cutting wheel, and the first cutter and the second cutter are opposite provided and the second cutting wheel is located between the first cutting wheels; and the control member connecting to the first cutter and the second cutter by signals, the control member controlling the first cutter to cut the upper plate downward along a gravity direction, and controlling the second cutter to cut the lower plate upward in a reverse direction of the gravity direction.