Biological Liquid Crystal Image Sensor With Removable Coverplate

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Solution Overview

Problem

Existing image sensors lack a straightforward method for applying antibodies or antigens to biological liquid crystal surfaces for analysis, limiting their application in clinical medicine and biological science.

Innovation Solution

An image sensor design featuring a semiconductor substrate with adhesive frames, biological liquid crystals with antigen- or antibody-modified interfaces, and a bonding layer that loses bonding power upon heating or UV irradiation, allowing easy removal of a glass coverplate for direct application of substances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a glass coverplate is permanently bonded to seal the biological liquid crystal, then the sealing and protection of the liquid crystal is improved, but the ease of accessing the liquid crystal surface for antibody or antigen application deteriorates

Engineering Contradiction:
Improvesealing reliabilityVSAvoidaccessibility to liquid crystal surface
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The bonding layer is pre-designed with reversible bonding characteristics that allow it to maintain strong adhesion during assembly and operation, but can be easily deactivated through UV irradiation or heating. This preliminary design enables the coverplate to be firmly sealed during manufacturing while allowing easy removal later for sample application.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The bonding characteristics of the bonding layer are made changeable through external parameters (UV light exposure or temperature changes). The bonding layer transitions from a strongly bonded state during assembly to a weakly bonded state when exposed to UV light or heat, enabling easy removal of the coverplate without damaging other components.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If the bonding layer maintains strong bonding power continuously, then the structural stability and sealing are improved, but the ease of removing the glass coverplate for sample application deteriorates

Engineering Contradiction:
Improvestructural stabilityVSAvoidcoverplate removability
Core Design Contradiction:
Stability of the object's compositionVSEase of operation

Solution Approach 1:

The bonding layer's bonding power is made dynamic rather than static. It can switch between strongly bonded and weakly bonded states based on external conditions (UV irradiation or heating). This dynamic characteristic allows the system to maintain structural stability during normal operation while enabling easy coverplate removal when needed.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The bonding characteristics are made controllable through parameter changes (UV exposure or temperature). The bonding layer responds to these parameter changes by adjusting its bonding strength, allowing the system to transition between stable assembly and easy disassembly states as required by different operational phases.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If a complex assembly process is used to ensure proper bonding, then the bonding reliability is improved, but the manufacturing complexity and time consumption deteriorates

Engineering Contradiction:
Improvebonding reliabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The traditional mechanical or thermal bonding processes are replaced with a chemical bonding mechanism that can be activated and deactivated through UV irradiation or heating. This substitution simplifies the assembly process while maintaining reliable bonding, as the bonding layer automatically forms strong bonds upon contact without requiring complex bonding equipment or procedures.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The bonding layer performs the bonding function automatically upon contact between the coverplate and substrate, without requiring external bonding equipment or complex procedures. The bonding occurs self-service through the inherent properties of the bonding layer material, significantly simplifying the manufacturing process while ensuring reliable bonding.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy access for antibody or antigen application on biological liquid crystals, facilitating image signal acquisition for analysis and enhancing the sensors' applicability in biomedical detection.

Implementation Method 1

a bonding layer, configured to bond the adhesive frame to the glass coverplate, wherein the bonding layer loses a bonding power when heated or irradiated by an UV light

Methodology Applied
Scientific EffectUV irradiation: Photopolymerisation

Implementation Method 2

a bonding layer, configured to bond the adhesive frame to the glass coverplate, wherein the bonding layer loses a bonding power when heated or irradiated by an UV light

Methodology Applied
Scientific EffectThermal heating: Heating

Implementation Method 3

When exposed to an applied electric field, liquid crystal molecules will have their long axes oriented along the electric field direction

Methodology Applied
Scientific EffectElectro-optic activity: Electro-Optic Effects

Implementation Method 4

Thanks to birefringence, orientational order, electro-optic activity and other unique characteristics of liquid crystal molecules

Methodology Applied
Scientific EffectBirefringence: Birefringence

Data Source

PatentUS20240038812A1Image sensor and method for fabricating same
Publication Date: 2024.02.01 HUA WEI SEMICONDUCTOR (SHANGAHAI) CO LTD
  • US20240038812A1 patent drawing
  • US20240038812A1 patent drawing
  • US20240038812A1 patent drawing

AI summary

An image sensor and method for fabricating are provided. The image sensor includes: a semiconductor substrate with multiple pixel regions formed thereon; adhesive frame formed on the semiconductor substrate, the adhesive frame including a peripheral adhesive frame arranged along the periphery of the semiconductor substrate and multiple reaction well adhesive frames disposed within the peripheral adhesive frame; a biological liquid crystal filled at least in each of the reaction well adhesive frames, the biological liquid crystal having an antigen-modified or an antibody-modified liquid crystal sensing interface; a glass coverplate disposed opposite to the semiconductor substrate; and a bonding layer, bonding the adhesive frames to the glass coverplate and loses a bonding power when heated or irradiated by UV light.