Liquid Discharge Head Adhesive Bonding with Uneven Substrate Walls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid discharge heads face challenges in achieving high adhesive strength when joining substrates using adhesive bonds, which affects the reliability and longevity of the bonding process.
Innovation Solution
The implementation of uneven portions on the surface of the holding substrate, with specific cross-sectional shapes and dimensions, to increase the adhesive area and anchor effect, combined with a surface treatment film to enhance compatibility and resistance to liquid corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a flat surface is used for joining substrates with adhesive bond, then the manufacturing process is simple, but the adhesive strength is insufficient
Solution Approach 1:
The invention applies surface curvature by forming uneven portions (protrusions and recesses) on the joining surface of the holding substrate. This curved/uneven surface structure increases the adhesive strength through mechanical interlocking, directly resolving the contradiction between simple manufacturing and sufficient adhesive strength.
Solution Approach 2:
The invention creates a porous-like structure on the joining surface through the uneven portions (protrusions and recesses). This increased surface roughness and porosity provides more anchoring points for the adhesive, significantly improving adhesive strength while maintaining manufacturing feasibility.
2Reliability
If adhesive bond is used to join substrates, then the joining process is simple, but the bond durability against liquid corrosion is insufficient
Solution Approach 1:
The uneven surface structure with protrusions and recesses creates a mechanical interlocking effect that resists liquid corrosion. The curved surfaces and increased path length prevent liquid from easily penetrating the adhesive bond, thereby improving bond durability against liquid corrosion.
Solution Approach 2:
The uneven portions act as an intermediary structure between the holding substrate and the adhesive bond. This intermediate structure provides both mechanical support and resistance to liquid corrosion, protecting the adhesive bond while maintaining the simplicity of the adhesive joining process.
3Strength
If adhesive bond thickness is increased to improve strength, then the adhesive strength increases, but the liquid penetration resistance decreases
Solution Approach 1:
The uneven surface structure allows the adhesive bond to form a thicker layer while maintaining liquid penetration resistance. The protrusions and recesses create a tortuous path for liquid, preventing easy penetration even when the overall adhesive thickness is increased for strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the adhesive strength and reliability of the bonding process, prolonging the effective duration of the adhesive bond and enhancing the overall performance of the liquid discharge head.
Implementation Method 1
joining a flow path substrate (20) and a holding substrate (50) to each other by means of an adhesive bond (80)
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A first member is a flow path substrate 20, a second member is a holding substrate 50, a joining surface 20a of a flow path substrate 20 is joined to a joining surface 50a of a holding substrate 50 by an adhesive bond 80, a wall surface 55 of the opening 51 of the holding substrate 50 is a wall surface crossing the joining surface 50a of the holding substrate 50 joined to the joining surface 20a of the flow path substrate 20, an uneven portion 56 is provided on the wall surface 55 of the opening 51 of the holding substrate 50, and a part of the adhesive bond 80 joining the joining surface 20a of the flow path substrate 20 to the joining surface 50a of the holding substrate 50 is embedded in at least a part of the uneven portion 56 of the wall surface 55.