Liquid Discharge Head Thermal Insulation Between Heat Sink and Body

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Solution Overview

Problem

Despite heat dissipation from the driver IC to the heat sink, thermal conduction from the heat sink to the head body remains an issue in liquid discharge heads.

Innovation Solution

A liquid discharge head with a thermal insulation part disposed between the heat sink and the head body, reducing thermal conduction from the heat sink to the head body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is disposed on the opening of the casing to dissipate heat from the driver IC, then heat dissipation performance is improved, but thermal conduction from the heat sink to the head body increases causing temperature rise near discharge holes

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidthermal conduction to head body
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

A thermal insulation part is introduced as an intermediary component between the heat sink and the head body. This insulation part blocks the harmful thermal conduction path while allowing the heat sink to continue dissipating heat from the driver IC, thus resolving the contradiction between heat dissipation performance and preventing thermal damage to the head body

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal management system is segmented into distinct functional zones: the heat sink handles heat dissipation from the driver IC, while the thermal insulation part creates a thermal barrier zone between the heat sink and the head body. This segmentation allows each component to perform its specific function without interfering negatively with other components

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces thermal conduction from the heat sink to the head body, helping to maintain a lower temperature near the discharge holes and improve the reliability of the liquid discharge process.

Implementation Method 1

a thermal insulation part disposed between the heat sink and the head body

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

a heat sink which is disposed on the opening of the casing and configured to dissipate heat generated in the driver IC

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS20250128530A1Liquid discharge head and recording device
Publication Date: 2025.04.24 KYOCERA CORP
  • US20250128530A1 patent drawing
  • US20250128530A1 patent drawing
  • US20250128530A1 patent drawing

AI summary

A liquid discharge head is provided in which heat of a heat sink is less apt to transfer to a head body. The liquid discharge head includes a head body having a discharge hole for discharging a liquid therethrough, a driver IC configured to control driving of the head body, a casing which is disposed on the head body and has openings on a side surface of the casing, and a heat sink which is disposed on the openings of the casing and configured to dissipate heat generated in the driver IC, and a thermal insulation part disposed between the heat sink and the head body. This makes it possible to reduce the likelihood that the heat of the heat sink transfers to the head body.