Liquid Discharge Head Pressure Equalization via Air Communication Channel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing liquid discharge heads face issues with peeling off of protection tapes due to pressure differences, leading to film formation defects and reduced adhesion strength of the protection film, which affects the reliability of electrical connections between terminal electrodes and pressure generators.
Innovation Solution
Incorporating an air communication channel and communication hole in the second substrate, which communicates with the terminal opening and through hole of the first substrate, helps to equalize pressure and reduce deformation of the protection tape, preventing film formation on terminal electrodes and enhancing the reliability of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protection tape is applied to the terminal electrode to prevent film formation, then the terminal electrode is protected from film formation defects, but the protection tape peels off due to pressure differences during liquid discharge
Solution Approach 1:
A groove is introduced as an intermediary structure between the terminal electrode and the protection tape. The groove allows pressure equalization by providing a pathway for pressure relief, preventing the pressure differences that cause tape peeling while maintaining the protective function against film formation
Solution Approach 2:
The groove structure creates a porous-like configuration that allows pressure to pass through or equalize across the terminal electrode region. This porous structure enables pressure management while maintaining the integrity of the protection tape and electrical connection
2Manufacturing precision
If the protection tape is tightly bonded to the terminal electrode, then film formation is prevented, but deformation occurs due to pressure differences during operation
Solution Approach 1:
The groove acts as a mediator that allows the protection tape to remain bonded to the terminal electrode while providing a pressure relief pathway. This prevents the pressure-induced deformation that would otherwise occur in a tightly bonded configuration
3Productivity
If pressure is applied to the pressure chamber to discharge liquid, then liquid discharge performance is improved, but pressure differences cause protection tape peeling and film formation defects
Solution Approach 1:
The groove serves as a pressure equalization pathway that allows high pressure to be applied to the pressure chamber for efficient liquid discharge while preventing pressure differences from causing protection tape peeling or film formation on the terminal electrode
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces deformation of the protection tape and prevents film formation on terminal electrodes, improving the reliability of electrical connections and maintaining the integrity of the bonded substrate.
Implementation Method 1
Incorporating an air communication channel and communication hole in the second substrate, which communicates with the terminal opening and through hole of the first substrate, helps to equalize pressure and reduce deformation of the protection tape
Data Source
AI summary
A liquid discharge head includes a nozzle configured to discharge a liquid, a pressure chamber communicating with the nozzle, a pressure generator configured to apply pressure on the pressure chamber, a first substrate including a terminal electrode connected to the pressure generator, and a second substrate including a bonding surface bonded to the first substrate, the second substrate including a terminal opening exposing the terminal electrode of the first substrate. The first substrate includes a through hole penetrating through the first substrate, and the second substrate includes a communication hole communicating with the through hole of the first substrate and an air communication channel on a surface opposite to the bonding surface, the air communication channel communicating with the terminal opening and the communicating hole.