Liquid Discharge Head Resist Transfer for Thickness Uniformity
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Solution Overview
Problem
Conventional manufacturing methods for liquid discharge heads face challenges in achieving uniform thickness and opening dimension of nozzles due to variations in pressure and temperature distributions during the lamination of dry films, leading to difficulties in producing high-quality prints.
Innovation Solution
A manufacturing method that involves transferring a first resist onto a board by moving a transfer member in a specific direction with pressure applied from one side, followed by transferring a second resist onto the first resist in a different direction, to ensure uniformity of dry film thickness and nozzle dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dry films are laminated using conventional methods, then the liquid discharge head can be manufactured, but the thickness of the dry films becomes non-uniform due to pressure and temperature distribution variations
Solution Approach 1:
The patent applies asymmetry by transferring resist films in alternating directions (first direction, then second direction perpendicular to the first). This asymmetric transfer sequence causes thickness variations from different transfer operations to overlap and average out, converting systematic non-uniformity into random variations that cancel each other, thereby achieving uniform overall thickness without complex control systems
Solution Approach 2:
The patent introduces a dimensional approach by considering thickness uniformity in multiple transfer directions rather than relying on uniformity in a single lamination direction. By transferring films orthogonally (90 degrees apart), the method transforms a one-dimensional uniformity problem into a two-dimensional averaging process, where variations along one axis are compensated by variations along the perpendicular axis
2Manufacturing precision
If the length of one chip is prolonged to improve print performance, then print quality improves, but the thickness of nozzles and opening dimension of discharge port cannot become uniform
Solution Approach 1:
The alternating transfer directions create an asymmetric compensation effect that works across the entire chip length. Even as chip length increases, the orthogonal transfer sequence ensures that thickness variations accumulate randomly rather than systematically, maintaining uniformity across extended dimensions without compromising print performance
Data Source
AI summary
A manufacturing method of a liquid discharge head for manufacturing a liquid discharge head by transferring a resist to a board having a liquid supply port of the liquid discharge head includes a first step of transferring the first resist to the board by relatively moving a transfer member to a first direction in a state where the transfer member is pressed from a side opposite to a side opposed to the board with respect to the first resist. The method includes a second step of transferring the second resist onto the first resist by relatively moving the transfer member to a second direction, which is different from the first direction, in a state where the transfer member is pressed from a side opposite to a side opposed to the first resist with respect to the second resist.