Liquid Discharge Head Wall Deformation Control
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Solution Overview
Problem
In liquid discharge heads, the adhesion of a circuit board to a channel substrate can cause deformation and damage to the substrate's wall due to the applied load, leading to potential functional issues.
Innovation Solution
The design includes a channel substrate with a specific adhering portion that faces a hollow space and lateral walls, distributing the load across multiple columns and narrow portions, thereby reducing the pressure on the adhesive wall and preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is adhered to the channel substrate at the adhering portion facing the cavity, then the electrical connection between the contact point and the circuit board is achieved, but the wall of the channel substrate gets deformed due to the load exerted to the adhering portion
Solution Approach 1:
The channel substrate wall is divided into multiple segments (first wall portion, second wall portion, third wall portion) that collectively support the adhering portion. This segmentation distributes the load across multiple structural elements, preventing deformation of any single wall while maintaining electrical connection reliability.
Solution Approach 2:
The support structure is extended into the hollow space (third dimension) by adding protrusions that face the cavity. These protrusions provide additional support points from the opposite side of the adhering portion, creating a multi-dimensional load distribution system that prevents wall deformation.
2Reliability
If the circuit board is adhered to the channel substrate, then the electrical connection is established, but the load exerted to the adhering portion may damage the wall of the channel substrate
Solution Approach 1:
The channel substrate is designed with localized structural enhancements (protrusions and multiple wall portions) specifically at the region where the adhering portion is located. These local quality improvements provide targeted reinforcement exactly where the load is applied, preventing wall damage while maintaining overall structural integrity.
Solution Approach 2:
The protrusions facing the hollow space are positioned beforehand to provide preemptive support against the load that will be applied during circuit board adhesion. This prior cushioning structure prevents wall damage before it can occur by distributing the adhesive load across multiple reinforced points.
Data Source
AI summary
There is provided a liquid discharge apparatus which includes a channel substrate having a nozzle, a pressure chamber which communicates with the nozzle, an actuator which covers the pressure chamber, and a contact point that is electrically connected to the actuator, and a circuit board which has wires that are to be electrically connected to contact points, and which is adhered to the channel substrate. The channel substrate includes an adhesive wall which is provided with contact points, and which has a surface to which an adhering portion of the circuit board to be adhered to the channel substrate, is adhered, and further includes a wall portion which is provided with a cavity on a side of the adhesive wall, opposite to the surface, and which demarcates the cavity on a side opposite to the surface, of the adhesive wall, and the adhering portion is facing the cavity and the wall portion.