Liquid Discharge Wiring Substrate for High-Speed Waveform Accuracy
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Solution Overview
Problem
Existing liquid discharge devices face challenges in achieving high-speed dot formation cycles due to waveform distortion in drive signals, particularly when additional drive signals are introduced, and there is a lack of clear guidance on wiring disposition for improved signal propagation.
Innovation Solution
A wiring substrate design that optimizes the layout of drive signal and reference voltage signal wiring to minimize inductance components, using flexible coupling members and differential signaling to enhance signal accuracy and speed, with a drive signal selection circuit that controls the waveform selection for each discharge portion based on print data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the wiring through which the drive signal propagates and the wiring through which the reference voltage signal propagates are made to overlap with each other along the normal direction, then the waveform accuracy of the drive signal is improved due to mutual cancellation of inductance components, but the image formation speed cannot be increased sufficiently
Solution Approach 1:
The patent transitions from two-dimensional planar wiring layout to three-dimensional stacked wiring configuration. Drive signal wiring and reference voltage signal wiring are arranged in different layers (first wiring substrate and second wiring substrate) and overlap along the normal direction, utilizing the third dimension to achieve both signal cancellation and high-speed performance
Solution Approach 2:
A ground wiring is introduced as an intermediary between the drive signal wiring and reference voltage signal wiring. This ground wiring serves as a shield that reduces electromagnetic interference while maintaining the overlapping configuration, enabling both high waveform accuracy and high-speed operation
2Productivity
If a new drive signal is added to shorten the waveform cycle and increase dot formation speed, then the image formation speed is improved, but waveform distortion occurs due to inadequate wiring disposition guidance
Solution Approach 1:
The patent establishes the optimized overlapping wiring configuration and ground shielding arrangement before introducing multiple drive signals. This preliminary structural preparation ensures that when multiple drive signals are added for high-speed operation, the wiring infrastructure is already optimized to prevent waveform distortion
Solution Approach 2:
The patent changes the wiring configuration parameters by arranging drive signal and reference voltage signal wirings in overlapping three-dimensional configuration with specific spacing and ground shielding, enabling the system to handle multiple drive signals at higher frequencies without waveform distortion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized wiring substrate and drive signal selection circuit improve signal waveform accuracy and enable higher-speed dot formation cycles, ensuring precise ink discharge and image quality in liquid discharge devices.
Implementation Method 1
a device using a piezoelectric element is known. Piezoelectric elements are provided corresponding to each of a plurality of discharge portions in a print head. When the piezoelectric element is driven according to a drive signal, an amount of liquid is discharged from the corresponding discharge portion
Data Source
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AI summary
A liquid discharge device in which an inter-wiring region between a first wiring through which a first drive signal, and a second wiring through which a second drive signal propagates includes a wide inter-wiring region in which an inter-wiring distance between the first wiring and the second wiring is larger than a sum of a wire width of a fourth wiring and a minimum diameter of a via wiring, and a narrow inter-wiring region in which the inter-wiring distance is smaller than the sum of the wire width of the fourth wiring and the minimum diameter of the via wiring, and larger than a wire width of the via wiring, and a third wiring is not located in the narrow inter-wiring region between a virtual line coupling a first terminal and a second terminal, and the wide inter-wiring region, in the inter-wiring region of a first wiring layer.