Liquid Dispensing Device Drive Circuit Heat Sink Design
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Solution Overview
Problem
The existing liquid dispensing devices face issues with heat dissipation from transistors generating large amplitude drive signals, leading to increased transistor temperatures and unstable operation.
Innovation Solution
Incorporating a first heat sink on the opposite side of the substrate to dissipate heat from the first transistor, improving heat management and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is dissipated from the substrate via multiple electrodes on the chip body portion mounting surface, then the heat dissipation path is established, but the heat dissipation amount is insufficient causing transistor temperature increase
Solution Approach 1:
The patent introduces a heat sink extending in the thickness direction (Z-direction) of the substrate, creating a new spatial dimension for heat dissipation. This vertical extension allows heat to be conducted through the substrate thickness and dissipated from both surfaces, significantly increasing the heat dissipation area without expanding the footprint on the substrate mounting surface.
Solution Approach 2:
The heat sink is constructed using a composite structure with a main body portion made of heat-conductive material and a fin portion made of heat-dissipating material. This composite design optimizes both heat conduction through the substrate and heat dissipation from the extended surfaces, improving overall thermal management efficiency.
2Power
If large amplitude drive signals are generated to drive the liquid dispensing unit, then the liquid dispensing function is achieved, but large amount of heat is generated in the transistor
Solution Approach 1:
The patent converts the harmful heat generated by the high-power transistor into a manageable thermal flow by introducing a dedicated heat sink structure. The heat that would otherwise cause temperature rise and operational instability is now systematically conducted through the substrate and dissipated from the heat sink surfaces, transforming a harmful effect into a controlled thermal management problem.
3Productivity
If the transistor temperature increases due to insufficient heat dissipation, then the drive signal generation can proceed, but the operation becomes unstable
Solution Approach 1:
The heat sink is pre-installed on the substrate before the transistor operates at high power. This preliminary thermal management infrastructure ensures that heat dissipation pathways are already established and optimized, preventing temperature rise and operational instability before they can occur during high-power drive signal generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the operational stability of the drive signal generation unit by effectively managing heat generated during large amplitude signal transmission.
Implementation Method 1
a first heat sink provided on an opposite side of the substrate as viewed from the first transistor, and configured to dissipate heat from a first surface, which is on an opposite side of the substrate, among surfaces of a chip body portion of the first transistor
Data Source
AI summary
A liquid dispensing device includes: a liquid dispensing unit that dispense a liquid in response to a drive signal; and a drive signal generation unit configured to generate the drive signal. The drive signal generation unit includes an integrated circuit, a first transistor, a second transistor, a coil having one end electrically coupled to the first transistor and the second transistor and the other end electrically coupled to an output terminal, a substrate on which the integrated circuit, the first transistor, the second transistor, and the coil are mounted, and a first heat sink provided on an opposite side of the substrate as viewed from the first transistor, and configured to dissipate heat from a first surface, which is on an opposite side of the substrate, among a plurality of surfaces of a chip body portion of the first transistor.