Liquid Distribution Unit for Data Center Rack Cooling
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Solution Overview
Problem
Conventional manifold designs for liquid cooling in data centers are inefficient, leading to increased fluid pressure drop and reliability issues due to the lack of direct thermal connection between supply and return manifolds, resulting in longer liquid paths and increased connector points.
Innovation Solution
A liquid distribution unit (LDU) design that combines a cooling device and manifold for heat exchange, allowing for adjustable sub-ports and embedded cooling functions, directly connecting supply and return sub-ports to reduce fluid pressure drop and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If supply and return manifolds are mechanically combined as one unit but not thermally connected, then the manifold structure is simplified, but the liquid path becomes longer and fluid pressure drop increases
Solution Approach 1:
The supply manifold and return manifold are merged into a single integrated manifold body, eliminating the need for separate mechanical components and reducing the number of connectors. This integration shortens the liquid path and reduces fluid pressure drop while maintaining structural simplicity.
Solution Approach 2:
The manifold body itself acts as an intermediary that provides thermal connection between supply and return paths. The manifold material conducts heat between the supply and return channels, enabling thermal coupling without requiring separate thermal connection components.
2Adaptability or versatility
If supply and return manifolds are not directly connected, then the manifold design is more flexible, but the number of connectors and connection points increases and reliability decreases
Solution Approach 1:
By merging supply and return manifolds into one integrated unit, the number of connectors and connection points is reduced. This eliminates potential failure points associated with multiple connections while maintaining design flexibility through the integrated structure.
Solution Approach 2:
The integrated manifold performs multiple functions within a single component: it distributes supply liquid, collects return liquid, provides thermal connection, and reduces fluid path length. This multi-functionality improves reliability by reducing the number of separate components and connections required.
3Device complexity
If conventional manifold designs are used without embedded cooling functions, then the manifold structure is simpler, but the liquid path is longer and cooling efficiency is reduced
Solution Approach 1:
The cooling function is merged into the manifold structure itself through integrated cooling channels. This eliminates the need for separate cooling components and shortens the liquid path, improving cooling efficiency while maintaining relatively simple manifold construction.
Solution Approach 2:
The manifold is designed to perform both fluid distribution and cooling functions simultaneously. The integrated cooling channels enable the manifold to act as both a distribution system and a heat exchange system, improving cooling efficiency without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LDU design improves the efficiency and reliability of liquid cooling systems by shortening liquid distribution loops, reducing pressure drop, and increasing system flexibility, manufacturability, and serviceability, while lowering costs.
Implementation Method 1
a heat exchange channel or tube (425) embedded in the first cooling liquid for heat exchange, without direct contact between the first cooling liquid and the second cooling liquid
Implementation Method 2
heat exchange channel or tube (425) embedded in the first cooling liquid for heat exchange
Data Source
AI summary
An electronic rack liquid cooling system includes a rack manifold having a rack liquid supply line or channel and a rack liquid return line or channel. The liquid supply line is to receive first cooling liquid from a cooling liquid source and the liquid return line is to return first warmer liquid carrying the exchanged heat back to the cooling liquid source. The electronic rack further includes an array of server blades arranged in a stack therein. Each server blade includes one or more liquid cold plates associated with one or more information technology (IT) components. The electronic rack further includes a set of one or more liquid distribution units (LDUs) coupled between the rack liquid supply and return lines and the server blades. Each LDU includes a liquid supply port, a liquid return port, one or more pairs of supply sub-ports and return sub-ports, and a plate heat exchanger.