Liquid-Droplet Pickup Tools for High-Throughput Component Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing pick-and-place apparatuses face challenges such as low throughput due to slow vacuum switching speeds, inefficiency in transferring small components using vacuum, and inability to correct rotational offsets of electronic components.
Innovation Solution
The apparatus employs a movable transfer module with pickup tools that use liquid droplets instead of vacuum to capture and hold electronic components, allowing for improved alignment and transfer of smaller devices, and includes a drive unit and liquid droplet unit for precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vacuum is used to capture and hold electronic components, then components can be transferred, but throughput is hampered by slow vacuum switching speeds
Solution Approach 1:
The patent replaces the vacuum system (mechanical/pneumatic system) with a liquid droplet system. The liquid droplet is dispensed onto the pickup tool surface to capture and hold the electronic component, eliminating the need for vacuum switching and associated delays. This substitution directly addresses the throughput limitation caused by slow vacuum switching speeds.
2Productivity
If vacuum is used to capture electronic components, then components can be held, but small electronic components are transferred less efficiently
Solution Approach 1:
The patent changes the physical state and properties of the holding medium from gas (vacuum) to liquid. The liquid droplet provides surface tension and adhesive forces that are more effective for capturing and holding small electronic components compared to vacuum. This parameter change improves transfer efficiency for small components while maintaining reliable holding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances throughput by eliminating vacuum switching delays, improves the handling of small components, and enables correction of both positional and rotational offsets of electronic components during transfer.
Implementation Method 1
at least one droplet of a liquid on the first surface for allowing an electronic component released from the donor substrate to be captured and held by said at least one droplet of liquid
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Aspects of the present disclosure relate to a pick-and-place apparatus and method for transferring an electronic component from a donor substrate towards an acceptor substrate. The pick-and-place apparatus in accordance with embodiments of the present disclosure comprises a movable transfer module that includes at least one pickup tool, wherein each pickup tool is configured for picking up an electronic component and comprises a tool body having a first surface. The pick-and-place apparatus further comprises a drive unit that is mechanically coupled to the movable transfer module and that is configured for moving the transfer module. The pick-and-place apparatus additionally comprises a liquid droplet unit to provide, for each pickup tool, at least one droplet of a liquid on the first surface of that pickup tool for allowing an electronic component released from the donor substrate to be captured and held by said at least one droplet of liquid on said first surface.