Liquid Ejecting Head Adhesive Bonding for Moisture and Deformation
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Solution Overview
Problem
Existing liquid ejecting technologies face challenges with moisture evaporation due to high permeability adhesives and bonding failures caused by thermal deformation in resin material components.
Innovation Solution
The use of a combination of hard and soft adhesives, where hard adhesives with low moisture permeability are applied for bonding non-resin material components and components prone to thermal deformation, and soft adhesives for components forming flow passages, to prevent moisture evaporation and bonding failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a soft adhesive is used for bonding flow passage formation members, then bonding flexibility is improved, but moisture permeability increases causing moisture evaporation
Solution Approach 1:
The patent applies different adhesive properties to different bonding locations: soft adhesives are used where flexibility is needed (flow passage formation members), while hard adhesives are used where moisture barrier properties are critical (bonding resin members to non-resin members). This local differentiation resolves the contradiction by allowing each bonding interface to have the specific properties it needs.
2Object-affected harmful factors
If a hard adhesive is used for bonding flow passage formation members, then moisture permeability is reduced, but bonding strength decreases due to resin material deformation
Solution Approach 1:
The patent differentiates adhesive selection based on the specific bonding context: hard adhesives are used for bonding resin members to non-resin members where moisture barrier is critical, while soft adhesives are used for bonding flow passage formation members where flexibility is needed. This localized approach allows each interface to optimize for its specific requirements.
3Stability of the object's composition
If a soft adhesive is used for bonding resin material members forming flow passages, then bonding flexibility is maintained, but moisture evaporation increases
Solution Approach 1:
The patent applies hard adhesives specifically at bonding interfaces involving resin members where moisture loss would be problematic, while reserving soft adhesives for flow passage formation members where flexibility is the primary requirement. This localized differentiation resolves the contradiction by allowing each bonding interface to have the specific properties it needs.
Data Source
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AI summary
Two members among a plurality of members are bonded to each other with a hard adhesive. The plurality of members constitute a liquid ejecting head and the members are a member formed of a material other than a resin material and a member with a film shape formed of the resin material. Two members among the plurality of members are bonded to each other with a soft adhesive and the members constitute the flow passage between two members of which at least one is molded with the resin material. Two members among the plurality of members are bonded to each other with a hard adhesive and the members do not constitute the flow passage between two members of which at least one is molded with the resin material.