Liquid Ejecting Head Film Adhesive Hole Uniformity

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Solution Overview

Problem

Ink jet printing heads face irregular passage resistance due to deformation of film adhesives during the manufacturing process, leading to variations in ink ejection volume and speed across nozzle orifices.

Innovation Solution

The use of film adhesives with round holes of equal size, specifically designed to match the openings in the supply port and reservoir plates, reduces irregularity in the adhesive layer's capacity, thereby minimizing passage resistance and ensuring consistent ink ejection across all nozzle orifices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If heat and pressure are applied irregularly during the adhering operation, then the adhering process can be completed, but the deformation degree of holes in the film adhesive becomes different in every hole, causing irregular passage resistance and varying ink ejection performance

Engineering Contradiction:
Improveadhering processVSAvoidhole deformation uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming holes in the film adhesive with predetermined dimensions and positions before the adhering operation. This ensures that even when heat and pressure are applied during bonding, the holes maintain uniform deformation characteristics, preventing irregular passage resistance and ensuring consistent ink ejection across all nozzles.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If the film adhesive layer has thickness with deformed holes, then the adhering operation can be performed, but the capacity of space formed by holes becomes irregular, causing different passage resistance in every nozzle orifice

Engineering Contradiction:
Improveadhering operationVSAvoidpassage resistance consistency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies parameter changes by carefully controlling the dimensions, positions, and shapes of holes in the film adhesive. By optimizing these parameters before adhering, the holes maintain uniform characteristics even after deformation during bonding, ensuring consistent passage resistance and reliable ink ejection performance across all nozzles.

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If holes are formed in the film adhesive to match openings, then the nozzle communication ports remain unblocked, but the holes deform during heat and pressure application, causing irregular ink ejection volume and speed

Engineering Contradiction:
Improvenozzle communicationVSAvoidhole size uniformity
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming holes in the film adhesive with predetermined dimensions and positions before the adhering operation. This ensures that even when heat and pressure are applied during bonding, the holes maintain uniform deformation characteristics, preventing irregular passage resistance and ensuring consistent ink ejection across all nozzles.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration results in a liquid ejecting head with reduced irregularity in ink ejection volume and speed, enhancing the reliability and performance of ink jet printing by maintaining uniform passage resistance across all nozzle communication ports.

Implementation Method 1

The shape of the holes formed in the film adhesive is deformed due to the applied heat and pressure

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

The shape of the holes formed in the film adhesive is deformed due to the applied heat and pressure

Methodology Applied
Scientific EffectCompression: Compression

Implementation Method 3

heat-compressing one surface of a supply port plate and a first film adhesive

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 4

heat-compressing one surface of a supply port plate and a first film adhesive

Methodology Applied
Scientific EffectCompression: Compression

Data Source

PatentUS8234787B2Method of manufacturing a liquid ejecting head
Publication Date: 2012.08.07 SEIKO EPSON CORP
  • US8234787B2 patent drawing
  • US8234787B2 patent drawing
  • US8234787B2 patent drawing

AI summary

A first film adhesive between actuator units and a supply port plate, a second film adhesive between a reservoir plate and the supply port plate, and a third film adhesive between the reservoir plate and a nozzle plate are each provided with round holes having an equal size and formed in correspondence to the locations of nozzle communication ports. Thanks to the round holes having the equal size one another, irregularity in capacities of spaces formed by layers of the first film adhesive, the second adhesive, and the third film adhesive are reduced, thereby reducing a difference of passage resistance caused in the nozzle communication ports. Accordingly, it is possible to realize a printing head capable of reducing irregularity in an amount of ejected ink and a speed of ink drops between nozzles.