Liquid Ejecting Head Adhesive Regeneration via Partial Curing
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Solution Overview
Problem
The existing methods for manufacturing liquid ejecting heads, such as ink jet recording heads, face challenges in component replacement and repair due to adhesive bonding, making it difficult to regenerate or maintain these devices effectively.
Innovation Solution
A method involving a heating step to plasticize the adhesive bonding components, allowing for disassembly and replacement of at least one component, followed by re-bonding with a new adhesive, enabling the regeneration of the liquid ejecting head.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to bond components of the liquid ejecting head, then the bonding strength and reliability are improved, but the ease of repair and component replacement deteriorate
Solution Approach 1:
The patent applies parameter changes by controlling the curing degree of the adhesive through adjusted curing conditions. The adhesive is cured to 5-50% of its full curing level, creating a semi-cured state that maintains sufficient bonding strength during assembly while allowing easy disassembly later for component replacement and repair.
2Stability of the object's composition
If adhesive bonding is used to bond components, then the structural integrity is improved, but the adaptability for regeneration and maintenance deteriorates
Solution Approach 1:
The patent enables regeneration capability by controlling the adhesive curing parameter. The adhesive is cured to a partial extent (5-50% curing degree) that provides enough structural integrity for normal operation while retaining the ability to be easily separated for component replacement and device regeneration.
3Duration of action of stationary object
If strong adhesive bonding is used, then the durability of the assembly is improved, but the ease of manufacture for maintenance purposes deteriorates
Solution Approach 1:
The patent resolves the contradiction between durability and maintenance ease by changing the curing parameter of the adhesive. By curing the adhesive to 5-50% of its full curing level, the assembly achieves sufficient durability for operation while maintaining ease of disassembly for maintenance and component replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach facilitates the replacement and regeneration of components within the liquid ejecting head, reducing waste and maintenance costs by allowing for the repair and refurbishment of individual parts rather than the entire device.
Implementation Method 1
a heating step of heating an adhesive that bonds and cures the first component and the second component to plasticize the adhesive
Implementation Method 2
a heating step of melting an adhesive until a crack formed in the adhesive is closed by heating the adhesive that bonds and cures the first component and the second component
Data Source
AI summary
A method of manufacturing a liquid ejecting head including a first component and a second component, the method includes a heating step of heating an adhesive that bonds and cures the first component and the second component to plasticize the adhesive, a disassembling step of releasing a bonding state between the first component and the second component by the heating step, and a replacing step of replacing at least one of the first component and the second component with a new product after the disassembling step.