Liquid Ejecting Head Segmented Bonding to Reduce Supply Port Deformation
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Solution Overview
Problem
The deformation of the supply port plate in liquid ejecting heads due to bonding loads affects the ink supply amount, leading to variations in ejection characteristics.
Innovation Solution
A liquid ejecting head design with a pressure chamber substrate, communication substrate, and coupling substrate configuration where the communication substrate is bonded to overlap the pressure chamber between the supply and nozzle communication flow paths, and the partition wall, reducing deformation and maintaining consistent ink ejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the supply port plate is made extremely thin to reduce deformation, then the manufacturing precision is improved, but the plate becomes more susceptible to deformation by bonding loads
Solution Approach 1:
The communication substrate is divided into a first region and a second region that are bonded to the coupling substrate at different locations. The first region overlaps the pressure chamber while the second region overlaps the partition wall, creating segmented bonding zones that distribute mechanical loads and prevent deformation of the supply port area.
Solution Approach 2:
Different regions of the communication substrate serve different functions: the first region provides fluid communication with the pressure chamber, while the second region provides structural support by bonding to the partition wall. This local differentiation allows the thin substrate to maintain both precision and resistance to deformation.
2Strength
If the supply port plate is bonded over a wide area to reduce deformation, then the strength is improved, but the manufacturing complexity increases
Solution Approach 1:
Instead of a single wide-area bond, the substrate is bonded at two separate locations (first and second regions), simplifying the bonding process while effectively distributing loads to prevent deformation.
3Ease of manufacture
If the supply port plate is not bonded in the vicinity of the supply port, then the ease of manufacture is improved, but the deformation under load increases
Solution Approach 1:
The bonding is segmented into two distinct regions that avoid the supply port area while still providing structural support through bonding to the partition wall, maintaining both ease of manufacture and shape stability.
Solution Approach 2:
The partition wall serves as an intermediary structure that transmits bonding loads away from the supply port area. By bonding the second region to the partition wall, the load is transferred through the rigid partition wall rather than directly to the thin supply port plate.
Data Source
AI summary
A liquid ejecting head includes a pressure chamber substrate having a pressure chamber, a drive element, a communication substrate having a supply communication flow path and a nozzle communication flow path at a position different from the supply communication flow path, and a coupling substrate having a supply port and the supply communication flow path and a discharge port, in which the pressure chamber substrate has a partition wall, and the communication substrate includes a first region bonded to the coupling substrate and overlapping the pressure chamber between the supply communication flow path and the nozzle communication flow path when viewed in a thickness direction, and a second region bonded to the coupling substrate and overlapping the partition wall at a position adjacent to the first region via an opening of the supply communication flow path when viewed in the thickness direction of the pressure chamber substrate.