Liquid Ejecting Head Holder with Curved Heat Path
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Solution Overview
Problem
The existing liquid ejecting heads, such as those used in ink jet printers, face inefficiencies in heating due to heat dissipation from the heater to the support body through conductive holders, leading to ineffective heating of the driver components.
Innovation Solution
A liquid ejecting head design featuring a holder with a heat receiving portion and a flange portion that contacts the support body at a position away from the holding portion, with a heat transfer path that is bent or curved at multiple points to reduce heat dissipation to the support body, allowing for more efficient heating of the head chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the holder is made of a conductive material for grounding purposes, then the electrical grounding is improved, but the heat from the heater is dissipated to the support body via the holder, worsening the heating efficiency
Solution Approach 1:
The holder is divided into functionally distinct portions: a holding portion for supporting the head chip and a flange portion for grounding contact. This segmentation allows the holding portion to retain heat for efficient heating of the head chip while the flange portion provides the necessary electrical grounding path to the support body, resolving the contradiction between grounding reliability and heat dissipation.
Solution Approach 2:
Different portions of the holder are given different thermal characteristics. The holding portion is designed to be thermally isolated to maintain heat for efficient head chip heating, while the flange portion is designed to conduct heat away for grounding purposes. This local differentiation of thermal properties allows simultaneous achievement of heating efficiency and grounding reliability.
2Use of energy by moving object
If the heater is positioned close to the holding portion for efficient heating, then the heating efficiency is improved, but the heat is easily dissipated to the support body, worsening the temperature control
Solution Approach 1:
The holder is segmented into a holding portion and a flange portion positioned away from each other. The heater is positioned adjacent to the holding portion, enabling efficient heat transfer to the head chip while the separated flange portion prevents direct heat dissipation path to the support body, thus maintaining temperature stability.
Solution Approach 2:
The holding portion acts as an intermediary between the heater and the head chip, concentrating and transferring heat efficiently while the flange portion serves as a separate intermediary for grounding. This intermediary structure allows the heater to be positioned close to the holding portion for efficient heating without direct heat loss to the support body.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the thermal efficiency of the liquid ejecting head, ensuring consistent and accurate temperature management of the head chips, reducing temperature variations and improving the overall heating performance.
Implementation Method 1
a heater heating the holding portion
Implementation Method 2
a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points
Data Source
AI summary
A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.