Liquid Ejecting Head Regeneration via Terminal Group Segmentation
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Solution Overview
Problem
Existing liquid ejecting heads face challenges in efficiently replacing or reusing head chips and relay substrates due to strong electrical coupling, leading to unnecessary discarding of functional components when one fails, as releasing the electrical coupling often damages the components and prevents reusability.
Innovation Solution
A manufacturing method that involves electrically separating and reassigning terminal groups between head chips and relay substrates, allowing for the replacement and reuse of individual components within the liquid ejecting head, thereby extending the life cycle of functional parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the relay substrate and wiring member are bonded to each other to reduce electrical coupling portions, then the electrical connection is improved, but the ease of repair deteriorates because the head chip and relay substrate cannot be easily separated for replacement
Solution Approach 1:
The invention segments the electrical connection system into three distinct parts: the head chip, the wiring member, and the relay substrate. By introducing a wiring member as an intermediate component with terminal groups that connect to both the head chip terminal group and relay substrate terminal group, the system allows the head chip to be replaced independently without damaging the relay substrate, thus improving ease of repair while maintaining reliable electrical connections.
2Reliability
If components are strongly bonded to ensure electrical coupling, then the reliability of electrical connection is improved, but the loss of substance increases because functional components must be discarded when one component fails
Solution Approach 1:
The invention divides the electrical coupling system into separable segments (head chip, wiring member, relay substrate) connected through terminal groups. This segmentation allows the head chip to be replaced without discarding the functional relay substrate and wiring member, reducing component waste while maintaining reliable electrical coupling through the terminal group connections.
Solution Approach 2:
The invention enables recovery and reuse of functional components (relay substrate and wiring member) by allowing replacement of only the failed head chip. The terminal groups are designed to facilitate this recovery process, where the relay substrate and wiring member can be retained and reused, thereby reducing material loss and waste.
3Ease of repair
If the terminal groups are forcibly released to enable component replacement, then the ease of repair is improved, but the reliability deteriorates because the terminal groups are damaged and cannot be reused
Solution Approach 1:
The invention segments the electrical connection into modular terminal groups that can be separated and reconnected. The wiring member with its terminal groups acts as an intermediary that can be detached from the head chip and reconnected to a replacement head chip, enabling easy repair without damaging the terminal groups and preserving their functionality for reuse.
Data Source
AI summary
A manufacturing method of a liquid ejecting head is a manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head including a first head chip and a relay substrate including a terminal group α and a terminal group β, which are electrical coupling terminals to the first head chip. The manufacturing method includes a replacing step of replacing the first head chip with a second head chip compatible with the first head chip. The replacing step includes a first step of electrically separating the terminal group α from the first head chip, and a second step of electrically coupling the terminal group β that is compatible with the terminal group α to the second head chip.