Liquid Ejecting Head Sealing Structure to Reduce Chip Warping
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Solution Overview
Problem
The reliability of liquid ejecting heads is compromised due to the reaction force of the sealing member when sandwiched between the head module and the supply flow path member, leading to potential warping and reduced print quality.
Innovation Solution
A liquid ejecting head design where the sealing region between the flow path opening forming member and the supply flow path member overlaps the chip, with the dimension of the flow path opening forming member being larger than the distance between the sealing region and the fixing member, reducing the impact of the reaction force on the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing member is sandwiched between the head module and the supply flow path member to liquid-tightly couple the flow path, then liquid-tight coupling is achieved, but reliability of the head module decreases due to reaction force of the sealing member
Solution Approach 1:
A reaction force receiving portion is provided on the supply flow path member to receive the reaction force of the sealing member. This intermediary structure prevents the reaction force from directly acting on the head module, thereby resolving the contradiction between achieving liquid-tight coupling and maintaining head module reliability
Solution Approach 2:
The reaction force is extracted from the head module by providing a dedicated receiving portion on the supply flow path member. This separates the harmful reaction force effect from the critical head module, allowing the sealing member to function without compromising reliability
2Reliability
If the sealing region overlaps the chip, then the impact of reaction force on the chip is reduced, but the structure becomes more complex
Solution Approach 1:
The sealing region is merged with the chip area by positioning them to overlap. This integration allows the sealing function to simultaneously protect the chip from reaction forces, achieving improved reliability without adding separate protective structures
Solution Approach 2:
The sealing region is positioned in a different spatial arrangement (overlapping in plan view) rather than linear alignment. This dimensional repositioning allows the sealing function to protect the chip from reaction forces while maintaining a compact structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the liquid ejecting head by minimizing warping and improving print quality, while allowing for a more compact design.
Implementation Method 1
an elastic first sealing member that is sandwiched between the first head module and the supply flow path member in the first direction to liquid-tightly couple the first flow path opening and a flow path opening of the supply flow path member to each other
Data Source
AI summary
A liquid ejecting head includes: a head module that includes a flow path opening forming member and a chip; a supply flow path member that supplies a liquid to the head module; an elastic sealing member that liquid-tightly couples the flow path opening forming member and the supply flow path member to each other; and a fixing member that fixes the supply flow path member and the flow path opening forming member, in which a sealing region sandwiched between the flow path opening forming member and the supply flow path member in the sealing member overlaps the chip when viewed in an ejection direction, and a dimension of a portion of the flow path opening forming member that overlaps the sealing region in the ejection direction is larger than a distance between the sealing region and the fixing member when viewed in the ejection direction.