Liquid Ejecting Head Sealing Structure to Reduce Chip Warping
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Solution Overview
Problem
The reliability of liquid ejecting heads is compromised due to the reaction force of the sealing member when sandwiched between the head module and the supply flow path member, leading to potential warping and reduced print quality.
Innovation Solution
The design includes a first head module with a flow path opening forming member and a supply flow path member, where the sealing region overlaps the chip, and the dimension of the flow path opening forming member overlapping the sealing region is larger than the distance between the sealing region and the fixing member, reducing the impact of the reaction force on the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing member is sandwiched between the head module and the supply flow path member to liquid-tightly couple the flow path, then liquid-tight coupling is achieved, but reliability decreases due to reaction force causing warping
Solution Approach 1:
A reaction force receiving portion is provided in the flow path opening forming member to receive the reaction force from the sealing member. This intermediary structure prevents the reaction force from directly acting on the chip, thereby resolving the contradiction between achieving liquid-tight coupling and preventing warping of the head module.
2Shape
If the sealing region overlaps the chip, then compact design is achieved, but warping increases due to reaction force on the chip
Solution Approach 1:
The reaction force receiving portion acts as an intermediary that intercepts the reaction force from the sealing member before it can reach the chip. This allows the sealing region to overlap with the chip area for compact design while preventing warping through the mediator structure.
3Reliability
If the dimension of flow path opening forming member overlapping sealing region is larger than distance to fixing member, then reaction force impact on chip is reduced, but device complexity increases
Solution Approach 1:
The flow path opening forming member is segmented into functional regions: a sealing region for liquid-tight coupling and a reaction force receiving portion for force management. This segmentation allows the structure to reduce reaction force impact on the chip while maintaining reasonable complexity through clear functional division.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the liquid ejecting head by minimizing warping and improving print quality, while allowing for a more compact design by optimizing the positioning of the sealing and fixing members.
Implementation Method 1
an elastic first sealing member that is sandwiched between the first head module and the supply flow path member in the first direction to liquid-tightly couple the first flow path opening and a flow path opening of the supply flow path member to each other
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A liquid ejecting head includes: a head module that includes a flow path opening forming member and a chip; a supply flow path member that supplies a liquid to the head module; an elastic sealing member that liquid-tightly couples the flow path opening forming member and the supply flow path member to each other; and a fixing member that fixes the supply flow path member and the flow path opening forming member, in which a sealing region sandwiched between the flow path opening forming member and the supply flow path member in the sealing member overlaps the chip when viewed in an ejection direction, and a dimension of a portion of the flow path opening forming member that overlaps the sealing region in the ejection direction is larger than a distance between the sealing region and the fixing member when viewed in the ejection direction.