Liquid Ejecting Head Sealing Structure for Ink Adhesion
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Solution Overview
Problem
Existing liquid ejecting heads face issues with ink adhesion to electric connections due to differences in linear expansion coefficients between sealing materials and components, leading to potential warping and reduced printing quality, limiting the use of sealing resins to those with low viscosity.
Innovation Solution
A liquid ejecting head design utilizing a flexible wiring member and thermosetting sealing materials, where the wiring member is covered by a sealing material and a cover member, preventing ink invasion and enhancing electrical reliability through the use of high-viscosity thermosetting epoxy resin and low-elasticity rubber-modified epoxy resin for sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a sealing material with low viscosity and low curing temperature is used to prevent ink adhesion, then ink resistance is improved, but the sealing material cannot provide sufficient protection against external forces and structural stability deteriorates
Solution Approach 1:
The sealing structure is divided into two distinct materials: a low-viscosity sealing resin (epoxy resin) that prevents ink adhesion, and a separate adhesive agent (rubber-modified epoxy resin) that provides mechanical bonding and protection against external forces. This segmentation allows each material to optimize its specific function without compromise.
Solution Approach 2:
The patent employs a composite sealing system combining epoxy resin with rubber-modified epoxy resin adhesive agent. This composite structure leverages the ink resistance properties of epoxy resin while incorporating the mechanical strength and flexibility of rubber-modified material, achieving both ink protection and structural integrity.
2Strength
If a thermosetting sealing material is used to provide structural stability, then protection against external forces is improved, but ink may adhere to the electric connection due to curing shrinkage and warping
Solution Approach 1:
The sealing function is segmented between two materials: the thermosetting epoxy resin provides structural stability and protection against external forces, while the rubber-modified epoxy resin adhesive agent with lower curing temperature prevents ink adhesion by minimizing curing shrinkage and warping.
Solution Approach 2:
The patent changes the curing temperature parameter by using rubber-modified epoxy resin adhesive agent with lower curing temperature compared to the thermosetting epoxy resin. This parameter change allows the adhesive layer to cure with minimal shrinkage, preventing ink adhesion while maintaining the structural integrity provided by the thermosetting resin.
3Ease of operation
If the wiring member is exposed on the support member surface, then ease of electrical connection is improved, but ink invasion to the electric connection increases
Solution Approach 1:
The sealing structure applies local quality differentiation: the rubber-modified epoxy resin adhesive agent is applied specifically to the wiring member surface that requires ink protection, while maintaining electrical connectivity. This localized sealing prevents ink invasion at the critical interface without compromising the overall ease of electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses ink invasion into electric connections, improving electrical reliability and maintaining printing quality by using thermosetting sealing materials that provide stability and protection against external forces.
Implementation Method 1
a sealing material sealing the connection
Implementation Method 2
thermosetting sealing materials
Implementation Method 3
a cover member provided on the support member... a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered by the sealing material and the cover member
Data Source
AI summary
A liquid ejecting head including a print element substrate including an ejection opening for ejecting a liquid, a wiring member including wiring electrically connected to the print element substrate, a connection electrically connecting the print element substrate to the wiring member, a support member supporting the wiring member, a sealing material sealing the connection, and a cover member provided on the support member. In the liquid ejecting head, the wiring member is a strip-shaped member, and a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered by the sealing material and the cover member.