Liquid Ejecting Head Thermal Management via High-Conductivity Support

A heat dissipation fin is introduced as an intermediary component between the drive IC and the surrounding environment. The fin extends from the drive IC housing and provides additional surface area for heat dissipation, effectively transferring heat from the internal components to the external environment without requiring direct contact or complex cooling systems.

The patent utilizes natural convection and radiation as phase transition mechanisms for heat dissipation. The heat dissipation fin increases the surface area for convective heat transfer and radiative heat loss, enabling efficient heat removal from the drive IC through passive thermal management without active cooling components.

The heat dissipation fin serves as a thermal intermediary that separates the heat-generating drive IC from the ink storage and ejection system. By providing an external heat dissipation path through the fin, the thermal coupling between the drive IC and the ink system is reduced, maintaining stable ink viscosity and ejection characteristics.

The patent converts the harmful heat generated by the drive IC into a manageable thermal flow by directing it through the heat dissipation fin to the external environment. The heat that would otherwise degrade ink properties is instead channeled through the fin structure, where it is dissipated harmlessly to the surrounding air, thereby protecting the ink ejection system from thermal contamination.