Liquid Ejecting Head Terminal Edge Insulation
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Solution Overview
Problem
Existing liquid ejecting heads face issues with conductive substances adhering to the cut edges of plating leads, leading to potential leaks or shorts, especially with functional elements requiring long voltage applications, which complicates manufacturing and increases the risk of malfunctions.
Innovation Solution
A liquid ejecting head design where a second terminal connected to multiple lands is positioned on the same edge as a first terminal, allowing insulating resin to cover the cut edge of the second terminal without adding a new processing step, thereby preventing conductive substances from adhering and reducing manufacturing inefficiencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If functional element-specific plating leads are disposed on different edges of the contact board, then the plating process can be performed, but the cut edges of these leads are exposed and susceptible to conductive substance adhesion causing leaks or shorts
Solution Approach 1:
The patent merges the protection of functional element-specific plating leads with other plating leads by disposing both types of leads on the same edge of the contact board. This allows a single insulating resin coating step to cover all cut edges of both lead types, eliminating the need for separate protection measures and reducing overall device complexity while maintaining reliability
Solution Approach 2:
The patent applies insulating resin to cover the cut edges of plating leads before the liquid ejecting head is assembled and before conductive substances can adhere. This preliminary protective action prevents the adhesion of conductive substances that would otherwise cause leaks or shorts, ensuring reliability from the outset
2Reliability
If insulating resin is applied to cut edges of functional element-specific plating leads, then leaks and shorts are prevented, but manufacturing efficiency is lowered due to additional process steps
Solution Approach 1:
The patent combines the insulation process for functional element-specific plating leads with the insulation process for other plating leads into a single manufacturing step. By positioning both lead types on the same edge, the manufacturing process applies insulating resin once to protect all leads, maintaining productivity while ensuring reliability
Solution Approach 2:
The patent makes the insulating resin application step universal by designing it to protect all types of plating leads (both functional element-specific and other leads) simultaneously. This multi-functional approach ensures that a single manufacturing step provides comprehensive protection, preventing leaks and shorts without reducing productivity
3Adaptability or versatility
If functional elements with long voltage application times are used, then functionality is enhanced, but susceptibility to conductive substance adhesion effects increases
Solution Approach 1:
The patent applies insulating resin to cover the cut edges of plating leads before the liquid ejecting head is assembled and before conductive substances can adhere. This preliminary protective action prevents the adhesion of conductive substances that would otherwise cause leaks or shorts, ensuring reliability from the outset
Solution Approach 2:
The patent applies insulating resin to create a protective barrier that counteracts the potential harmful effect of conductive substance adhesion. By establishing this protective layer in advance, the patent neutralizes the risk of leaks and shorts that would otherwise be exacerbated by long voltage application times
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents malfunctions such as shorts and leaks between terminals without lowering the manufacturing efficiency of the contact board or liquid ejecting head, ensuring reliable operation.
Implementation Method 1
insulating resin that covers the edge face of the second terminal positioned on the one edge of the contact board
Implementation Method 2
Electroplating is typically used for the plating, and involves applying a voltage to the conducting portions of the deposition target terminals when depositing the plating film
Data Source
AI summary
The liquid ejecting head includes a printing element board having a plurality of printing elements for producing energy used to eject liquid, a contact board having a contact terminal for electrically connecting to a liquid ejection printing apparatus, and a functional element, and a plurality of lands which are provided on a face of the contact board where the functional element is mounted, and to which terminals of the functional element are connected. In addition, a wiring member connects the printing element board to the contact board, a first terminal is configured to be electrically connected to the printing element board, and a second terminal is configured to not be electrically connected to the printing element board, with both terminals disposed on one edge of the contact board. A first wiring connects the contact terminal to the first terminal, a second wiring connects at least one of the plurality of lands to the second terminal, and insulating resin covers an edge face of the second terminal positioned on the one edge of the contact board.