Liquid Ejecting Head Stacked Plate Warpage Suppression
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Solution Overview
Problem
Liquid ejecting heads with stacked plates made of different materials experience warpage due to varying coefficients of thermal expansion, leading to reliability issues as adhesives peel off under temperature changes.
Innovation Solution
The use of holding members with higher stiffness than the plates, fixed to the end surfaces of the structure, to suppress thermal expansion and reduce stress between plates, preventing adhesive peeling and enhancing reliability at a low cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plates with different materials are used to optimize manufacturing and characteristics, then ease of manufacture and plate characteristics are improved, but warpage occurs due to different coefficients of thermal expansion
Solution Approach 1:
The invention changes the physical parameters of the holding member by selecting materials with specific stiffness characteristics (higher than the plate with highest thermal expansion coefficient) to counteract thermal expansion effects and prevent warpage while maintaining manufacturing flexibility
2Reliability
If holding members with high stiffness are fixed to end surfaces, then thermal expansion is suppressed and adhesive peeling is prevented, but device complexity increases
Solution Approach 1:
The invention segments the structure by adding discrete holding members at specific locations (end surfaces of plates) rather than requiring a completely redesigned structure, thus improving reliability while minimizing overall complexity increase
Solution Approach 2:
The holding members act as intermediary elements between the plates and the external environment, mediating the thermal expansion forces and protecting the adhesive bonds without requiring direct modification of the plate materials or adhesive formulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the extension of plates and prevents adhesive peeling, thereby enhancing the reliability of the liquid ejecting head while allowing for easier manufacturing due to the use of different materials like silicon and metal.
Implementation Method 1
At least two plates of the plates have different coefficients of linear expansion in the one direction... When temperature rises, a stress is produced between the head chip and the holding member due to the extension
Data Source
AI summary
A liquid ejecting head (recording head) includes a structure (flow path member) having a plurality of stacked plates (a nozzle plate, a flow path plate, and a diaphragm) in which end surfaces at both sides in one direction are aligned. At least two plates of the plates (the nozzle plate, the flow path plate, and the diaphragm) have different coefficients of linear expansion in the one direction, and holding members are fixed to the end surfaces of the structure (flow path member) at both sides in the one direction, the holding members having stiffness higher than stiffness of a plate having the highest coefficient of linear expansion in the one direction among the plates (the nozzle plate, the flow path plate, and the diaphragm).