Liquid Ejecting Head Overlapping Wiring Substrates
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Solution Overview
Problem
Existing liquid ejecting heads face challenges in reducing size while maintaining the ability to supply ink to multiple head main bodies efficiently, as reducing the flow-path member's size complicates the arrangement of flow paths and wiring substrates.
Innovation Solution
The design includes a flow-path member with a distribution flow path and bifurcation flow paths that allow liquid to be supplied to multiple head main bodies without the need for additional opening portions for wiring substrates, enabling a compact layout by overlapping flexible wiring substrates and optimizing the positional arrangement of connection portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the flow-path member is reduced, then the overall size of the liquid ejecting head is reduced, but the width of the flow-path member (area except for opening portions) is further reduced making it difficult to provide flow paths for multiple head main bodies
Solution Approach 1:
The patent changes the arrangement dimension of flexible wiring substrates from a planar layout to a three-dimensional overlapping layout. Multiple flexible wiring substrates are positioned to overlap in the thickness direction of the flow-path member, allowing them to share the same planar space while maintaining electrical connectivity to different head main bodies. This dimensional transition resolves the contradiction by enabling multiple substrates to coexist in a reduced planar area without increasing the overall head size.
Solution Approach 2:
The flow-path member is designed with opening portions that serve dual functions: they provide passage for flexible wiring substrates and simultaneously serve as shared infrastructure for multiple head main bodies. The distribution flow path communicates with multiple connection portions through these opening portions, allowing a single flow-path member structure to support multiple ejection units without requiring separate wiring channels for each.
2Device complexity
If multiple head main bodies are supplied using one flow-path member, then the structure is simplified, but the positional arrangement becomes complex when flexible wiring substrates need to connect to each head main body
Solution Approach 1:
The patent positions flexible wiring substrates to overlap in the thickness direction of the flow-path member, transitioning from a two-dimensional planar arrangement to a three-dimensional configuration. This allows multiple substrates to be manufactured and assembled in a standardized overlapping pattern, simplifying the manufacturing process despite the complex positional requirements. The overlapping arrangement enables consistent positioning relative to opening portions while connecting to different head main bodies.
3Ease of operation
If opening portions are provided for flexible wiring substrate insertion, then electrical connection is enabled, but the flow-path member requires additional space that increases overall size
Solution Approach 1:
The opening portions in the flow-path member serve multiple functions simultaneously: they provide insertion passages for flexible wiring substrates, act as structural support elements, and enable communication between the distribution flow path and multiple connection portions. This multi-functionality eliminates the need for separate dedicated spaces for wiring insertion, allowing electrical connection capability to be integrated into the existing flow-path structure without increasing overall size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the size of the liquid ejecting head and improves the layout flexibility, allowing for efficient ink supply to multiple head main bodies within a smaller space without increasing the number of holes or complicating the wiring arrangement.
Implementation Method 1
a pressure generation unit, such as a piezoelectric element, in such a manner that ink droplet is discharged through the nozzle opening
Data Source
AI summary
Provided is a liquid ejecting head which includes head bodies aligned in a direction of liquid ejection surface thereof, a flow-path member in which distribution flow path is provided to supply liquid to the head bodies, and flexible wiring substrates connected to the head bodies. The distribution flow path extends in the first direction. In addition, the flexible wiring substrates adjacent in the first direction overlap when viewed from the first direction. The distribution flow path is disposed in an area on one side with respect to the flexible wiring substrates, in a direction perpendicular to the first direction in the liquid ejection surface.