Liquid Ejecting Head Wiring Substrate Connection Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid ejecting heads, such as ink jet type recording heads, face challenges in compact design due to narrow gaps between communication ports and conductive members, leading to difficulties in connection and increased size.
Innovation Solution
A liquid ejecting head design that allows for interconnection of wiring members and substrates without widening the gap between inlets, using a common flow path and specific flow path configurations to ensure compact size and ease of assembly, while reducing the risk of disconnection and extending the wiring member beyond the connection flow path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If two communication ports are disposed in proximity to each other in the head chip, then the head size is reduced, but the connection area between the conductive member and the wiring substrate is narrowed making connection difficult
Solution Approach 1:
The patent extends the connection flow paths in the longitudinal direction of the head chip, utilizing the length dimension to provide sufficient connection area. The first and second connection flow paths are configured to extend from the first and second communication ports respectively, allowing the conductive member to make reliable contact with the wiring substrate along the extended path direction, thus resolving the space constraint imposed by proximity of communication ports.
2Reliability
If the wiring member is extended outside the connection flow path to ensure connection, then connection reliability is improved, but the head size increases
Solution Approach 1:
The connection flow paths are pre-configured to extend sufficiently from the communication ports to the wiring substrate connection points. This preliminary arrangement of flow paths ensures that the wiring member can be connected reliably within the compact head structure without requiring extension beyond the connection flow paths, thus maintaining both reliability and compact size.
3Ease of manufacture
If the wiring member is excessively bent to reach the wiring substrate, then connection is achieved, but disconnection risk increases
Solution Approach 1:
The connection flow paths are designed with adequate length and appropriate routing from the communication ports to the wiring substrate connection points. This preliminary configuration allows the wiring member to be installed with minimal bending, reducing mechanical stress and the risk of disconnection while still achieving reliable connection within the compact head structure.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A liquid ejecting head includes a head chip in which two or more nozzle groups are disposed in a reference direction (second direction) and a first inlet that communicates with one of the nozzle groups and a second inlet that communicates with the other nozzle group are disposed in the reference direction, a wiring member that is disposed between the first inlet and the second inlet and has one end portion connected to a pressure generating unit and the other end portion extending in the direction opposite to a direction of liquid ejection from a nozzle, a first connection flow path that is connected to the first inlet, a second connection flow path that is connected to the second inlet, and a wiring substrate to which the other end portion of the wiring member is connected between the first connection flow path and the second connection flow path, in which the second connection flow path has an extending flow path that extends from the second inlet toward the reference direction separated from the first inlet, and the wiring substrate is arranged on the side of the second connection flow path opposite to the first inlet from the extending flow path to extend in the reference direction beyond the second connection flow path from between the first connection flow path and the second connection flow path.