Liquid Ejecting Apparatus Heat Conduction Member
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Solution Overview
Problem
Liquid ejecting apparatuses face failures due to heat-generated issues and dust or mist adherence in the driving circuit, particularly when using reactive inks, which existing cooling techniques fail to adequately address.
Innovation Solution
Incorporating a heat sink and heat conduction member with insulating properties that do not react with reactive inks, ensuring effective heat dissipation and preventing mist adherence in the driving circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a housing is used to cool the driving circuit and suppress dust adherence, then heat dissipation and dust protection are improved, but reactive ink mist adherence to the driving circuit cannot be suppressed
Solution Approach 1:
A protective cover is introduced as an intermediary component between the reactive ink mist and the driving circuit. This cover specifically prevents the reactive ink mist from adhering to the driving circuit while allowing the housing to continue its heat dissipation function. The protective cover acts as a barrier that selectively blocks harmful ink mist without interfering with thermal management.
Solution Approach 2:
The protective cover is made from materials selected based on their resistance to reactive ink chemicals. The material composition is specifically chosen to be non-reactive with solvent inks and photoreactive inks, ensuring that the cover maintains its protective function over time without degrading or reacting with the ink mist.
2Loss of energy
If existing cooling techniques are used, then heat dissipation is improved, but chemical reactions with reactive ink cause material degradation over time
Solution Approach 1:
The material parameters of components exposed to reactive ink are carefully selected and optimized. The protective cover and heat conduction member are made from materials with specific chemical resistance properties that prevent reaction with solvent inks and photoreactive inks. This material parameter selection ensures long-term reliability while maintaining effective heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of failures such as short circuits and electrical leaks by efficiently dissipating heat and preventing reactive ink mist from adhering to the driving circuit, maintaining the protective and heat-dissipating functions over time.
Implementation Method 1
a heat conduction member that conducts the heat generated in the driving circuit to the heat sink
Implementation Method 2
a heat sink that dissipates heat generated in the driving circuit due to generation of the driving signal
Data Source
AI summary
A liquid ejecting apparatus includes an ejection portion that ejects a reactive ink, a driving circuit that generates a driving signal to drive the ejection portion, a heat sink that dissipates heat generated in the driving circuit due to generation of the driving signal, and a heat conduction member that conducts the heat generated in the driving circuit to the heat sink. The heat conduction member includes a heat conductive material with an insulating property whose state is not changed by a chemical reaction with the reactive ink, and a reinforcing member with an insulating property whose state is not changed by a chemical reaction with the reactive ink.