Liquid Ejection Driver IC Thermal Management via Metal Frame
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Solution Overview
Problem
Existing liquid ejection apparatuses face challenges in effectively dissipating heat generated by the driver IC during continuous operation, limiting their applicability across different head structures.
Innovation Solution
A novel liquid ejection apparatus design featuring a metal first frame and a thermally connected metal second frame with a liquid chamber, where the driver IC is positioned between the second frame's side walls and the upper wall acts as a heat spreader, facilitating efficient heat dissipation through a cooling mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a pressing member is used to press the driver IC toward the heat dissipating plate, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The pressing member is extracted and replaced by the inherent elastic force of the gasket, eliminating the need for a separate pressing component while maintaining thermal contact between the driver IC and heat dissipating plate
Solution Approach 2:
The gasket serves dual functions: sealing the liquid chamber and providing elastic pressure to maintain thermal contact between the driver IC and heat dissipating plate, combining sealing and thermal pressing functions in one component
2Temperature
If a novel heat dissipation structure is designed, then heat dissipation efficiency is improved, but ease of manufacture decreases
Solution Approach 1:
The gasket structure is designed to universally serve multiple functions (sealing and thermal pressing) that can be applied across different liquid ejection head designs, facilitating standardized manufacturing while achieving effective heat dissipation
Solution Approach 2:
The heat dissipating plate is designed with specific local thermal conduction properties at the driver IC contact area, focusing thermal management resources where needed without complicating the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation capabilities, effectively managing temperature rises in the driver IC and channel structure, thereby improving the operational reliability and versatility of liquid ejection apparatuses.
Implementation Method 1
the upper wall of the second frame is thermally connected to the driver IC
Data Source
AI summary
A liquid ejection apparatus, including: a channel structure in which a channel is formed; an actuator stacked on the channel structure in a stacking direction, the actuator configured to cause a liquid in the channel to be ejected; a first frame formed of metal and stacked on the channel structure in the stacking direction; a driver integrated circuit (IC) electrically connected to the actuator; and a second frame formed of metal, the second frame including at least two side walls facing each other and an upper wall extending between the two side walls and extending in a direction orthogonal to the stacking direction, the second frame being thermally connected to the first frame, wherein the driver IC is disposed between the two side walls, and the upper wall of the second frame is thermally connected to the driver IC.