Liquid Ejection Head Thermal Insulation via Composite Channels
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Solution Overview
Problem
The liquid ejection head experiences inefficiencies in liquid ejection due to heat dissipation from silicon-based liquid ejection channels, which are more thermally conductive than the synthetic resin supply channel structure, leading to temperature lowering of the liquid and inappropriate ejection from nozzles.
Innovation Solution
A liquid ejection head design featuring a channel structure made of silicon with a supply channel structure formed from a material with lower thermal conductivity, such as synthetic resin, where the supply channel structure covers the end surfaces of the channel structure to minimize heat dissipation, and includes a potting material with low thermal conductivity to further reduce heat loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicon-based channel structure is used for liquid ejection channels, then microfabrication capability is improved, but thermal conductivity increases causing heat dissipation
Solution Approach 1:
The liquid ejection head is divided into distinct functional modules: a silicon-based channel structure for microfabrication and a separate synthetic resin supply channel structure for thermal insulation. This segmentation allows each component to be optimized for its specific function while being integrated into a unified system.
Solution Approach 2:
The invention employs a composite structure combining silicon (high thermal conductivity) for the channel structure and synthetic resin (low thermal conductivity) for the supply channel structure. This composite approach leverages the advantages of both materials: silicon's microfabrication capability and synthetic resin's thermal insulation properties.
2Temperature
If heater is used to heat supply channel structure, then liquid viscosity is improved for ejection, but heat dissipation to environment worsens
Solution Approach 1:
The synthetic resin supply channel structure serves as a thermal intermediary between the heater and the liquid ejection channels. It transmits heat from the heater to the liquid while its low thermal conductivity prevents excessive heat loss to the environment, effectively mediating the thermal transfer process.
Solution Approach 2:
The invention changes the thermal conductivity parameter of the supply channel structure by using synthetic resin instead of silicon, thereby reducing heat dissipation while maintaining the heating function. This parameter change optimizes the balance between heating efficiency and heat retention.
3Manufacturing precision
If silicon channel structure is used, then manufacturing precision is improved, but thermal insulation performance worsens
Solution Approach 1:
The system is segmented into a silicon channel structure (optimized for manufacturing precision) and a synthetic resin supply channel structure (optimized for thermal insulation). This segmentation allows the silicon component to achieve high fabrication accuracy through microfabrication while the synthetic resin component provides the necessary thermal insulation.
Solution Approach 2:
By combining silicon and synthetic resin in a composite structure, the invention achieves both high manufacturing precision (from silicon microfabrication) and good thermal insulation (from synthetic resin). The composite material approach resolves the contradiction between these two opposing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces heat dissipation from the liquid ejection channels, maintaining the liquid's temperature and improving the efficiency of ink ejection from nozzles, ensuring consistent and appropriate ink flow.
Implementation Method 1
heating the supply channel structure using the heater enables the supply channel structure to be expanded, thereby curing the thermoset adhesive
Implementation Method 2
liquid supplied from the supply channels flows in the liquid ejection channels, its temperature is lowered by heat dissipation
Data Source
AI summary
A liquid ejection head includes a nozzle surface having a plurality of nozzles, a channel structure stacked on the nozzle surface in a stacking direction, and a supply channel structure formed of a material having a lower thermal conductivity than a material of the channel structure. The channel structure has a liquid ejection channel communicating with the nozzles. The supply channel structure has a supply channel communicating with the liquid ejection channel. The supply channel structure has a covering portion covering at least a portion of an end surface on a side of the channel structure in a width direction orthogonal to the stacking direction.