Liquid-Ejection Head CVD Deposition Filling Process
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Solution Overview
Problem
The existing methods for producing liquid-ejection heads with inorganic orifice plates formed by chemical vapor deposition (CVD) result in depressed portions that accumulate liquid and affect ejection direction, leading to degraded printing quality, and the conventional filling methods, such as chemical mechanical polishing (CMP), are costly and inefficient.
Innovation Solution
A method involving the formation of molds on a substrate, deposition of an inorganic material by CVD to create a flow-passage-forming member with depressed portions, application of a water-repellent layer, filling of these portions with a suitable material, and subsequent removal of molds, which efficiently fills depressed areas and suppresses liquid pool formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If molds are used to form liquid chambers during CVD deposition, then the liquid chambers can be formed with proper structure, but depressed portions are created between adjacent liquid chambers that cause liquid accumulation and printing quality degradation
Solution Approach 1:
The patent applies preliminary action by forming a water-repellent layer on the orifice plate surface before the filling process. This pre-treatment modifies the surface properties to prevent liquid accumulation in depressed portions, addressing the harmful effect before it occurs during operation
Solution Approach 2:
The patent converts the harmful depressed portions into a beneficial structure by intentionally filling them with filling material. The depression that originally caused liquid accumulation is transformed into a filled region that improves liquid ejection uniformity and printing quality
2Manufacturing precision
If conventional CMP method is used to fill depressed portions, then the depressed areas can be filled, but the production cost increases and efficiency decreases
Solution Approach 1:
The patent replaces the mechanical CMP process with a chemical filling approach. Instead of using mechanical polishing to fill depressed portions, the invention uses chemical vapor deposition to deposit filling material, which is then removed to achieve the desired filling effect, thereby improving productivity and reducing costs
Solution Approach 2:
The patent changes the processing parameters by using CVD deposition conditions to control the filling material deposition. By adjusting deposition parameters such as temperature, pressure, and gas flow, the filling process achieves precise control over the filled portions without requiring costly CMP equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively fills depressed portions, prevents liquid pool formation, and enhances printing quality while reducing production costs by using a more efficient filling process.
Implementation Method 1
forming the flow-passage-forming member by depositing an inorganic material on or above the substrate and the molds by chemical vapor deposition
Implementation Method 2
forming a water-repellent layer on the orifice plate
Data Source
AI summary
A method for producing a liquid-ejection head includes forming molds on or above the substrate, the molds being used as mold members for forming the plurality of liquid chambers; forming the flow-passage-forming member by depositing an inorganic material on or above the substrate and the molds by chemical vapor deposition, the flow-passage-forming member having depressed portions each formed in an area between an adjacent pair of the liquid-chamber side walls in which the molds are not formed; forming a water-repellent layer on the orifice plate; forming filling members in the depressed portions by applying a filling material to the flow-passage-forming member having the water-repellent layer formed thereon to fill the depressed portions with the filling material; forming the ejection ports in the flow-passage-forming member; and removing the molds after forming the ejection ports.