Liquid Ejection Head Recessed Adhesive Containment
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Solution Overview
Problem
Existing liquid ejection heads face issues with excess adhesive squeezing out of the bonding surface, which can adhere to structures and affect printing quality and device characteristics.
Innovation Solution
The implementation of recessed portions on non-bonding surfaces of substrates to receive and prevent the flow of excess adhesive, utilizing substrates with specific shapes and positions to minimize adhesive contact with critical elements like pressure generating and ejection ports.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are bonded with adhesive to form liquid ejection head, then bonding strength is improved, but excess adhesive squeezes out from bonding surface decreasing throughput and device characteristics
Solution Approach 1:
The bonding surface is designed with different local properties: a recessed portion with lower surface level to receive excess adhesive, and a non-recessed bonding area with higher surface level for proper bonding. This local differentiation allows the adhesive to be contained in specific areas while maintaining bonding effectiveness in other areas, thus preventing adhesive from squeezing out and affecting throughput and device characteristics.
2Strength
If substrates are bonded with adhesive to form liquid ejection head, then bonding strength is improved, but excess adhesive squeezes out from bonding surface affecting device characteristics
Solution Approach 1:
The bonding surface is designed with different local properties: a recessed portion with lower surface level to receive excess adhesive, and a non-recessed bonding area with higher surface level for proper bonding. This local differentiation allows the adhesive to be contained in specific areas while maintaining bonding effectiveness in other areas, thus preventing adhesive from squeezing out and affecting throughput and device characteristics.
3Object-generated harmful factors
If recessed portions are formed in bonding surface to receive excess adhesive, then adhesive squeezing out is prevented, but manufacturing complexity increases
Solution Approach 1:
The recessed portions are formed in advance on the bonding surface before the bonding process. By pre-forming these adhesive-receiving depressions, the design proactively prevents adhesive from squeezing out during bonding, eliminating the need for post-bonding cleanup or complex adhesive control mechanisms, thus reducing overall manufacturing complexity while effectively preventing adhesive-related problems.
Data Source
AI summary
A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.