Liquid Ejection Head Resist Film Thickness Precision
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Solution Overview
Problem
Existing methods for manufacturing liquid ejection heads face challenges in precisely forming resist thickness on substrates due to the immediate removal of dry film supports, which affects the precision of ejection orifice machining and image quality in ink jet recording devices.
Innovation Solution
A method involving a light-transmitting support with a resist film, where the resist film is bonded to a substrate, exposed, and then immersed in a dissolving liquid to remove the removable portion, allowing precise formation of flow paths and pressure chambers while enabling easy peeling of the support, thereby maintaining the resist film's thickness and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the support is immediately peeled off after dry film transfer, then the manufacturing process is simplified, but the resist thickness precision deteriorates
Solution Approach 1:
The support is peeled off not immediately after transfer, but after the resist film has been fully formed and patterned. This preliminary action of delaying peeling allows the resist film to maintain its precise thickness throughout the entire manufacturing process, including exposure and development steps.
Solution Approach 2:
The support acts as a cushioning element that maintains the resist film's thickness and flatness throughout the manufacturing process. By keeping the support in place during exposure and development, it prevents deformation and ensures precise resist thickness, thereby cushioning against potential precision losses.
2Manufacturing precision
If the support is kept during resist film formation, then the resist thickness precision is improved, but the device complexity increases
Solution Approach 1:
The support is selectively removed only after it has served its purpose of maintaining resist thickness precision. The support is extracted from the system at the optimal moment - after the resist film is formed and patterned but before final processing - thereby eliminating its complexity contribution while preserving its beneficial effects during critical formation stages.
3Ease of operation
If the support is peeled off early, then the peeling process is simpler, but the ejection orifice machining precision deteriorates
Solution Approach 1:
The peeling operation is performed as a preliminary action after the resist film has been completely formed and patterned with high precision. By delaying peeling until this stage, the ejection orifice machining precision is maintained throughout the process, and the peeling itself becomes simpler because the resist film is already stable and firmly attached to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the precision of resist formation and ejection orifice machining, improving image quality and printing speed by maintaining the support's presence during resist film formation, ensuring accurate resist thickness and high peeling efficiency.
Implementation Method 1
immersing the substrate and the exposed resist film in the dissolving liquid, allowing the dissolving liquid to enter the through hole and removing the removable portion
Implementation Method 2
exposing the resist film with light transmitted from the second surface to the first surface of the support and forming a portion which is removable with a dissolving liquid
Data Source
AI summary
A method of manufacturing a liquid ejection head includes forming a resist film on a first surface of a light-transmitting support having the first surface and a second surface being a back surface of the first surface; bonding a back side of the surface of the resist film to the support side on a substrate having a through hole so as to block the through hole; exposing the resist film with light transmitted from the second surface to the first surface of the support and forming a portion which is removable with a dissolving liquid and a portion which remains against the dissolving liquid on the resist film; immersing the substrate and the exposed resist film in the dissolving liquid, allowing the dissolving liquid to enter the through hole, and removing the removable portion; and peeling the support from the resist film from which the removable portion has been removed.