Liquid Ejection Head Module Engagement for Thermal Alignment
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Solution Overview
Problem
Existing inkjet systems face misalignment of components due to thermal expansion of the flow path member causing misalignment of the ejection substrate, which affects the precision of high-resolution images.
Innovation Solution
The liquid ejection head includes a module with a support member configured to support the substrate and a frame that intersects the inserting direction of the module and supports the substrate via a space in a direction intersecting the inserting direction of the module and abut on each other in the inserting direction so as to be supported.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the ejection substrate is arranged with high accuracy to form high-resolution images, then the image resolution is improved, but the position alignment is vulnerable to thermal expansion of the flow path member
Solution Approach 1:
The device is divided into functionally independent modules: the ejection substrate module and the flow path member module, connected through a standardized engagement interface. This segmentation allows each module to be optimized independently and accommodates thermal expansion without affecting the other modules.
Solution Approach 2:
The flow path member is extracted from the ejection substrate module and connected via a separate engagement interface. This extraction allows the flow path member to thermally expand independently without transmitting expansion forces to the ejection substrate, thereby maintaining alignment stability.
2Device complexity
If the ejection substrate and flow path member are integrally configured using an adhesive agent, then the structure is simplified, but thermal expansion causes misalignment of the ejection substrate
Solution Approach 1:
The integral structure is segmented into separate ejection substrate module and flow path member, connected through a mechanical engagement interface rather than adhesive bonding. This allows independent thermal expansion while maintaining structural connection.
Solution Approach 2:
The connection method is changed from adhesive bonding to mechanical engagement with clearance tolerance. This parameter change allows the flow path member to expand thermally without transferring expansion forces to the ejection substrate, maintaining alignment while simplifying the overall structure.
3Adaptability or versatility
If the flow path member is made to supply ink to the ejection substrate, then the liquid ejection function is achieved, but thermal expansion of the flow path member causes misalignment
Solution Approach 1:
The flow path member is extracted as a separate module with its own thermal expansion characteristics, connected to the ejection substrate through a standardized interface. This allows the liquid ejection function to be maintained while isolating the thermal expansion effects to the flow path member only.
Solution Approach 2:
A standardized engagement interface acts as an intermediary between the flow path member and ejection substrate. This interface accommodates thermal expansion through clearance tolerance and geometric constraints, allowing the liquid ejection function to operate reliably while preventing misalignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses misalignment of the arrangement position of the ejection substrate even if a flow path member that supplies ink to the ejection substrate thermally expands, suppressing misalignment of the arrangement position of the ejection substrate even if a flow path member that supplies ink to the ejection substrate thermally expands.
Implementation Method 1
the flow path member thermally expands
Data Source
AI summary
A technology capable of suppressing misalignment of the arrangement position of an ejection substrate even if a flow path member thermally expands is provided. A module equipped with a substrate that ejects a liquid and a flow path that is fluidly connected to the substrate is inserted and engaged with a frame that supports a support member for supporting the substrate so that the frame and the flow path face each other via a space in a direction intersecting an inserting direction. Further, the module abuts on the frame in the inserting direction in a case of being inserted and engaged with the frame, so as to be supported.


