Liquid Ejection Head Wire Array Stability
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Solution Overview
Problem
Existing liquid ejection heads face issues with wire bonding fractures due to temperature-induced shrinkage and lateral loads, leading to stress on wires, which can result in buckling and short circuits when high-viscosity sealants are applied.
Innovation Solution
A liquid ejection head design where at least one wire at the end of the wire array is shorter or thicker than the others, reducing lateral displacement and acting as a block against external loads, preventing adjacent wires from contacting each other and minimizing stress from heat shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wire array is made more rigid to prevent lateral buckling, then short circuit prevention is improved, but stress from heat shrinkage increases, leading to wire fracture
Solution Approach 1:
The patent applies local quality by creating different wire length configurations at different positions in the wire array. The end wires are made shorter to provide rigidity and prevent lateral buckling during sealant application, while the middle wires are made longer to maintain flexibility and absorb longitudinal stress from heat shrinkage. This localized differentiation allows the wire array to simultaneously resist both lateral and longitudinal forces without requiring uniform rigidity throughout the entire array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents lateral buckling and short circuits while maintaining productivity by ensuring the wire array remains stable under both longitudinal stress and lateral loads, enhancing the reliability of the liquid ejection head.
Implementation Method 1
at least one of the plurality of wires at one end of the wire array in a wire array direction is shorter than the other wires
Implementation Method 2
The heat shrinkage changes the distance between the recording element substrate and the electrical wiring substrate, applying a stress to the wire connecting the recording element substrate with the electrical wiring substrate
Data Source
AI summary
A liquid election head includes a recording element substrate, an electrical wiring substrate configured to supply an electrical signal to the recording element substrate, a plurality of wires electrically connecting a plurality of electrode terminals on the recording element substrate with a plurality of connection terminals on the electrical wiring substrate, and a sealant sealing an electrical connection portion. The plurality of wires form a wire array. At least one of the plurality of wires positioned at one end of the wire array in a wire array direction is shorter than the other wires in the wire array.