Liquid Ejection Head Wiring for Temperature Uniformity
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Solution Overview
Problem
Existing liquid ejection heads face uneven temperature distribution in support members due to temperature differences between supply and discharge flow paths, leading to deformation and increased manufacturing costs when trying to address this with additional flexible circuits.
Innovation Solution
An electric wiring member with heat generating resistive lines integrated into the flexible wiring board, arranged between signal and power lines, to heat the support member and maintain even temperature distribution without requiring additional space or components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional flexible circuits are added to address temperature distribution issues, then temperature uniformity is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the heating function with the existing flexible wiring board by integrating heat generating resistive lines into the same substrate that carries signal and power lines. This consolidation eliminates the need for separate flexible heating circuits, thereby improving temperature uniformity while avoiding increased device complexity and manufacturing cost.
Solution Approach 2:
The flexible wiring board is designed to serve multiple functions: transmitting signals, supplying power, and generating heat for temperature control. By making the wiring board multi-functional through the integration of heat generating resistive lines, the patent achieves temperature uniformity without adding dedicated heating components that would increase device complexity.
2Temperature
If additional flexible circuits are added to address temperature distribution issues, then temperature uniformity is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the heating function with the existing flexible wiring board by integrating heat generating resistive lines into the same substrate that carries signal and power lines. This consolidation eliminates the need for separate flexible heating circuits, thereby improving temperature uniformity while avoiding increased device complexity and manufacturing cost.
3Temperature
If heat generating resistive lines are integrated into the flexible wiring board, then temperature uniformity is improved and device complexity is reduced, but wiring arrangement complexity increases
Solution Approach 1:
The patent applies local quality by strategically positioning heat generating resistive lines in specific regions of the flexible wiring board where heat is needed to compensate for temperature variations in the support member. This localized approach allows effective temperature control while maintaining a relatively simple overall wiring arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature unevenness in support members, preventing deformation and maintaining printing quality while reducing manufacturing costs by embedding heat generating resistive lines within existing flexible wiring boards.
Implementation Method 1
a heat generating resistive line for heating the support member
Data Source
AI summary
Provided is an electric wiring member supported by a support member that supports a recording element substrate configured to eject a liquid. The electric wiring member has a signal line for transmitting a drive signal used for driving the recording element substrate, a power line for supplying drive power to the recording element substrate, and a heat generating resistive line for heating the support member. The power line is arranged between the signal line and the heat generating resistive line.