Liquid Ejection Head Multi-Layer Wiring Through-Hole Design
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Solution Overview
Problem
The existing liquid ejection heads face issues with increased flow resistance in supply ports due to multi-layered wiring configurations, leading to reduced refilling speed and unstable ejection direction, particularly when the driving frequency of heaters is high, resulting in insufficient liquid supply and biased bubble generation.
Innovation Solution
The implementation of a substrate configuration with alternating rows of supply ports and energy generating elements, where through holes are strategically placed between supply port rows to reduce wiring area and flow resistance, allowing for multi-layered wiring that connects upper and lower wiring layers, thereby reducing the substrate size and improving liquid flow efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multi-layered wiring is implemented to reduce wiring arrangement area, then substrate size is reduced, but flow resistance in supply ports increases
Solution Approach 1:
The patent transitions from planar wiring arrangement to three-dimensional multi-layered wiring structure. Through-holes penetrate the substrate to connect upper and lower wiring layers, enabling vertical electrical connections that reduce the horizontal wiring arrangement area while maintaining electrical functionality.
Solution Approach 2:
The substrate is divided into multiple functional layers: upper wiring layer, through-holes for electrical connection, lower wiring layer, and supply ports. This segmentation allows independent optimization of each layer, enabling compact wiring layout without compromising liquid flow paths.
2Area of stationary object
If multi-layered wiring is implemented, then substrate size is reduced, but refilling speed decreases
Solution Approach 1:
The invention utilizes the thickness dimension of the substrate to arrange wiring layers vertically rather than horizontally. Through-holes provide vertical electrical pathways, enabling compact substrate footprint while preserving adequate supply port dimensions for high refilling speed.
Solution Approach 2:
By separating wiring functions into distinct upper and lower layers connected by through-holes, the patent isolates the wiring structure from the liquid flow paths. This segmentation ensures that wiring density does not compromise supply port geometry or liquid refilling performance.
3Area of stationary object
If wiring area is reduced through multi-layered configuration, then substrate size decreases, but ejection direction stability deteriorates
Solution Approach 1:
The patent employs vertical stacking of wiring layers with through-hole connections, reducing horizontal wiring spread. This compact arrangement minimizes interference with ejection orifice positioning and liquid flow symmetry, thereby maintaining stable ejection direction.
Solution Approach 2:
The multi-layered wiring structure segments electrical pathways from mechanical ejection components. This separation ensures that wiring compactness does not compromise the geometric symmetry of supply ports and ejection orifices, preserving ejection direction stability.
4Area of stationary object
If through-holes are provided for multi-layered wiring connection, then wiring arrangement area is reduced, but liquid flow resistance increases
Solution Approach 1:
The patent redirects electrical connections from the horizontal plane to the vertical dimension using through-holes. This dimensional transition concentrates wiring pathways vertically, leaving horizontal flow passages unobstructed and maintaining low liquid flow resistance.
Solution Approach 2:
The substrate is segmented into distinct functional zones: through-holes for electrical penetration, supply ports for liquid flow, and ejection orifices for droplet discharge. This segmentation ensures that through-holes do not interfere with liquid flow paths, maintaining optimal flow resistance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the throughput of the recording device by maintaining consistent liquid supply and stable ejection direction, preventing bubble bias and improving reliability by minimizing contact between liquid and conducting sections.
Implementation Method 1
Heaters 109a and 109b are provided at positions facing the ejection orifices 107a and 107b in the substrate 102. When the heaters 109a and 109b are driven, bubbles are generated in the liquid, so that the liquid is ejected from the ejection orifices.
Implementation Method 2
PTL 1 discloses a liquid ejection head in which through holes are provided.
Data Source
AI summary
A liquid ejection head includesa substrate includinga first supply port row in which a plurality of supply ports are arranged,a first energy generating element row in which a plurality of energy generating elements are arranged,a second supply port row in which a plurality of supply ports are arranged,a second energy generating element row in which a plurality of energy generating elements are arranged,a first wiring layer and a second wiring layer for driving the energy generating elements, anda through hole configured to electrically connect the first wiring layer and the second wiring layer.The first energy generating element row, the first supply port row, the second supply port row, and the second energy generating element row are arranged in parallel in this order and the through hole is arranged between the first supply port row and the second supply port row.