Liquid Ejection Slide Mechanism for Heat Dissipation
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Solution Overview
Problem
Existing liquid ejecting apparatuses face instability in liquid ejection due to heat generation during high-speed operation, which alters the properties of the liquid and affects ejection stability.
Innovation Solution
A liquid ejecting apparatus with a slide portion that changes the flow path resistance by sliding along the opening surface, allowing for heat dissipation through liquid discharge, and includes a second slide portion for controlling discharge, enabling efficient ejection and heat release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the plate is reciprocated at high speed to change flow path resistance, then the liquid ejection control is improved, but heat is generated and liquid properties change
Solution Approach 1:
The patent extracts the harmful heat generated during plate reciprocation by introducing a separate discharge flow path that communicates with the liquid chamber. This discharge path allows liquid to flow out and carry away heat, separating the heat dissipation function from the main ejection function. The discharge flow path includes a discharge hole positioned to receive liquid from the liquid chamber, enabling thermal energy removal without affecting the primary liquid ejection process.
2Productivity
If the plate is reciprocated at high speed, then the flow path resistance changes rapidly, but heat generation causes instability in liquid ejection
Solution Approach 1:
The patent introduces liquid itself as an intermediary medium to transfer heat away from the reciprocating plate. The liquid flowing through the discharge flow path acts as a heat carrier, absorbing thermal energy from the plate and surrounding components and transporting it away. This intermediary approach allows rapid plate reciprocation for high productivity while maintaining ejection stability by preventing excessive heat accumulation.
3Reliability
If a separate discharge structure is added to dissipate heat, then liquid property stability is improved, but device complexity increases
Solution Approach 1:
The patent implements multi-functionality by designing the discharge flow path to serve multiple purposes: it acts as both a liquid supply path and a heat dissipation channel. The same flow path structure that delivers liquid to the ejection nozzle also provides thermal management by allowing continuous liquid flow that carries away heat. This eliminates the need for separate cooling systems and reduces overall device complexity while maintaining liquid property stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus stabilizes liquid ejection by dissipating heat generated during operation, maintaining liquid properties and ensuring efficient ejection, while simplifying the structure by integrating slide portions for simultaneous resistance adjustment.
Implementation Method 1
the first slide portion, by sliding along the opening surface of the first opening, changes the position of the first through hole with respect to the communication flow path and changes the flow path resistance of the communication flow path
Implementation Method 2
heat can be released by discharging the liquid from the discharge flow path
Data Source
AI summary
A liquid ejecting apparatus includes a liquid chamber that communicates with a nozzle, a communication flow path that communicates with the liquid chamber and that has a first opening into which a liquid flows, a discharge flow path that discharges the liquid and that has a second opening into which the liquid flows, a supply flow path capable of supplying the liquid to the communication flow path and the discharge flow path, and a first slide portion disposed between the supply flow path and the communication flow path and having a first through hole that enables the supply flow path to communicate with the communication flow path. The first slide portion, by sliding along the opening surface of the first opening, changes the position of the first through hole with respect to the communication flow path and changes the flow path resistance of the communication flow path.