Liquid Ejection Substrate Positioning for Ink Short-Circuit Prevention

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Solution Overview

Problem

In known liquid ejection apparatuses, ink dripping from the waste liquid tank often adheres to the substrate, leading to short-circuiting of the signal output circuit.

Innovation Solution

The apparatus is designed with a substrate positioned above the inlet of the waste liquid tank, incorporating a cap with a recess for the conductive member, and a discharge mechanism that prevents ink from adhering to the substrate, thereby preventing short-circuiting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the substrate is positioned below the waste liquid tank inlet, then the structure is simpler, but ink drips adhere to the substrate causing short-circuiting

Engineering Contradiction:
Improvestructural complexityVSAvoidcircuit reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The substrate is repositioned from a horizontal arrangement (below the inlet) to a vertical arrangement (above the inlet). This dimensional change in spatial configuration allows ink to drain away from the substrate rather than adhering to it, resolving the contradiction between structural simplicity and circuit reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the substrate is positioned above the inlet of the waste liquid tank, then ink adhesion is prevented, but the device structure becomes more complex

Engineering Contradiction:
Improvecircuit reliabilityVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By inverting the vertical positioning of the substrate relative to the waste liquid tank inlet, the design uses gravitational force to prevent ink adhesion. This simple vertical reconfiguration maintains reliability while avoiding the need for additional protective components.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If the substrate is disposed below the waste liquid tank, then installation is easier, but short-circuiting occurs due to ink adhesion

Engineering Contradiction:
Improveinstallation easeVSAvoidink adhesion causing short-circuit
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The vertical repositioning of the substrate changes the drainage path of ink. Ink flows downward due to gravity and exits through the inlet without contacting the substrate, eliminating the harmful adhesion effect while maintaining straightforward installation procedures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents ink from adhering to the substrate, thus avoiding short-circuiting and ensuring reliable operation of the signal output circuit.

Implementation Method 1

The signal indicates a potential difference between the liquid ejection head and the conductive member

Methodology Applied
Scientific EffectPotential difference: Electric Field

Data Source

PatentUS20220203691A1Liquid ejection apparatus
Publication Date: 2022.06.30 BROTHER KOGYO KK
  • US20220203691A1 patent drawing
  • US20220203691A1 patent drawing
  • US20220203691A1 patent drawing

AI summary

A liquid ejection apparatus includes a liquid ejection head having a nozzle surface with a plurality of nozzles, a conductive member configured to face the nozzle surface, a cap having a recess in which the conductive member is accommodated, a substrate including a signal output circuit, a controller configured to determine an ejection state of a nozzle based on a signal output from the signal output circuit, a waste liquid tank having an inlet, and a discharge mechanism configured to discharge liquid from the cap through the inlet into the waste liquid ink. The substrate is disposed above the inlet of the waste liquid tank.